Probe for testing semiconductor devices with features that increase stress tolerance
View Patent ↗A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
1. A probe card for testing a semiconductor device, comprising:
a substrate;
a probe connected to the substrate, the probe comprising
a base that is connected to the substrate;
a torsion element connected to the base;
a second element connected to the torsion element through a union angle, wherein the union angle comprises an interface between the torsion element and the second element wherein the edge of the interface is shaped to diffuse stress; and
a pivot connected to the substrate, wherein a portion of the probe contacts the pivot.
2. The probe card of claim 1 wherein the shape of the interface edge is selected from a group consisting of a plough, a triangle, a taper, a flare and combinations thereof.
3. The probe card of claim 1 wherein the probe comprises a cutout and the pivot contacts the probe at the cutout.
4. The probe card of claim 3 wherein the shape of the cutout is complementary to the shape of the pivot.
5. The probe card of claim 3 wherein the cutout is located at the union angle.
6. The probe card of claim 1 wherein the interface further comprises a buffer.
7. The probe card of claim 6 , wherein the buffer is comprised of a material selected from a group consisting of: NiCo and NiMn, Au and combinations thereof.
8. The probe card of claim 6 wherein the buffer is comprised of a material that is more ductile than the material out of which the second member is constructed.
9. The probe card of claim 1 wherein the probe is a torsional design.
10. The probe card of claim 1 wherein the probe is a hybrid design.
11. A probe card for testing a semiconductor device, comprising:
a substrate;
a probe connected to the substrate, the probe comprising a cutout; and
a pivot connected to the substrate, wherein the pivot contacts the probe at the cutout.
12. The probe card of claim 11 wherein the shape of the cutout is complementary to the shape of the pivot.
13. The probe card of claim 11 wherein the probe comprises a torsion element connected to a second element through a union angle, wherein the cutout is located at the union angle.
14. The probe card of claim 13 , the union angle comprising an interface between the torsion element and the second element, wherein the edge of the interface is shaped to diffuse stress; wherein the shape of the cutout is complementary to the shape of the interface.
15. The probe card of claim 14 wherein the shape of the interface edge is selected from a group consisting of: a plough, a triangle, a taper, a flare and combinations thereof.
16. The probe card of claim 14 wherein the interface further comprises a buffer.
17. The probe card of claim 16 wherein the buffer is comprised of a material selected from a group consisting of: NiCo and NiMn, Au and combinations thereof.
18. The probe card of claim 16 wherein the buffer is comprised of a material that is more ductile than the material out of which the second member is constructed.
19. The probe card of claim 11 wherein the probe is a torsional design.
20. The probe card of claim 11 wherein the probe is a hybrid design.
21. A probe card for testing a semiconductor device, comprising:
a substrate;
a probe connected to the substrate, the probe comprising
a base that is connected to the substrate;
a torsion element connected to the base;
a second element connected to the torsion element through a union angle, wherein the union angle comprises an interface between the torsion element and the second element, wherein the interface comprises a buffer; and
a pivot connected to the substrate, wherein a portion of the probe contacts the pivot.
22. The probe card of claim 21 wherein the buffer is comprised of a material selected from a group consisting of: NiCo and NiMn, Au and combinations thereof.
23. The probe card of claim 21 wherein the buffer is comprised of a material that is more ductile than the material out of which the second member is constructed.
24. The probe card of claim 21 wherein the probe comprises a cutout and the pivot contacts the probe at the cutout.
25. The probe card of claim 24 wherein the shape of the cutout is complementary to the shape of the pivot.
26. The probe card of claim 24 wherein the cutout is located at the union angle.
27. The probe card of claim 21 , wherein the edge of the interface is shaped to diffuse stress, and the shape is selected from a group consisting of: a plough, a triangle, a taper, a flare and combinations thereof.
28. The probe card of claim 21 wherein the probe is a torsional design.
29. The probe card of claim 21 wherein the probe is a hybrid design.