IP Library › Assignment 023003/0771
Patent Assignment
Reel/Frame 023003/0771

Change of Name

Recorded: 2009-07-27 Received: 2009-07-27 Pages: 4
Assignor
LAKE ACQUISITION, INC.
Executed: 2009-06-24
Assignee
TOUCHDOWN TECHNOLOGIES, INC.
650 PAGE MILL ROAD, PALO ALTO, CA, 94304, UNITED STATES
Covered Properties (34)
Microelectronic Wafer Contactor Assembly and Method of Forming the Same
Application: 61/153,731 →
Probe Card Substrate with Bonded Via
Application: 12/077,627 →
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Application: 12/042,295 →
Planarizing Probe Card
Application: 11/953,204 →
Lateral Interposer Contact Design and Probe Card Assembly
Probe Card Assembly and Method of Forming Same
Application: 11/986,453 →
Torsion Spring Probe Contactor Design
Application: 11/983,521 →
Method of Forming Probe Card Assembly
Application: 11/901,014 →
Forked Probe for Testing Semiconductor Devices
Application: 11/855,094 →
Method for Reparing a Microelectromechanical System
Application: 11/778,207 →
Semicoductor Testing Device with Elastomer Interposer
Application: 11/754,818 →
Post and Tip Design for a Probe Contact
Application: 11/796,482 →
Hybrid Probe for Testing Semiconductor Devices
Application: 11/734,434 →
System to Optimize a Semiconductor Probe Card
Application: 11/686,768 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Probe Head with Machine Mounting Pads and Method of Forming Same
Application: 11/641,255 →
Lateral interposer contact design and probe card assembly
Application: 11/633,324 →
Probe Card Assembly
Excess Overdrive Detector for Probe Cards
Application: 11/535,219 →
Lateral Interposer Contact Design and Probe Card Assembly
Probe Card with Balanced Lateral Force
Application: 11/457,132 →
Stacked Contact Bump
Application: 11/421,064 →
Optically Enhanced Probe Alignment
Application: 11/369,343 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Application: 11/346,954 →
Probe Card Assembly
Application: 11/317,408 →
Torsion Spring Probe Contactor Design
Process for Forming Microstructures
Post and Tip Design for a Probe Contact
Lateral interposer contact design and probe card assembly
Application: 11/226,568 →
Torsion Spring Probe Contactor Design
Application: 11/194,801 →
Post and Tip Design for a Probe Contact
Application: 11/194,720 →
Process for Forming Microstructures
Application: 11/102,982 →
Process for Forming Mems
Application: 11/019,912 →
Angled Flying Lead Wire Bonding Process
Application: 10/342,167 →