Forked probe for testing semiconductor devices
View Patent ↗A novel forked probe design for use in a novel probe card is presented that comprises a forked bending element that more efficiently stores displacement energy. Specifically, the novel probe card comprising a substrate and a forked probe connected to the substrate. The forked probe includes a base that is connected to the substrate and a forked bending element connected to the base, wherein the forked bending element comprises at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure. Connected to the first prong is the probe tip that is adapted to make contact with the DUT. Refinements to the probe card include that the first and second prongs are adapted to bend such that each prong elastically stores a portion of the displacement energy when the probe tip contacts the DUT. Also, the forked bending element may be manufactured using photolithography and using layered photolithography. Each prong may be comprised of different materials. And the forked bending element may be comprised of a nickel alloy. Also, the first prong may be constructed to be stiffer than the second prong, which may yield a shorter scrub length. The stiffness of the prongs may be manipulated by altering the geometry and/or material of the prongs.
1. A probe card for testing a semiconductor device, comprising:
a substrate;
a forked probe connected to the substrate, the forked probe comprising:
a base that is connected to the substrate;
a forked bending element connected to the base, wherein the forked bending element comprises
at least a first prong connected to a second prong through a prong connecting structure, wherein the first and second prongs extend away from the prong connecting structure in a first direction; and
a handle connected to the prong connecting structure, wherein at least a portion of the handle extends away from the prong connecting structure in a second direction that is opposite to the first direction and wherein the portion of the handle connects to the base; and
a probe tip connected to the first prong.
2. The probe card of claim 1 , wherein the first and second prongs and the handle are adapted to bend such that the prongs and the handle elastically store the displacement energy when the probe tip contacts the device.
3. The probe card of claim 1 further comprising a pivot connected to the substrate, wherein the second prong contacts the pivot while the probe tip contacts the device.
4. The probe card of claim 1 further comprising a pivot connected to the substrate, wherein the second prong contacts the pivot while the probe tip contacts the device.
5. The probe card of claim 1 further comprising a pivot connected to the second prong, wherein the pivot contacts the substrate while the probe tip contacts the device.
6. The probe card of claim 1 wherein the forked bending element is manufactured using photolithography.
7. The probe card of claim 1 wherein the first prong is manufactured using a first photolithographic layer, and the second prong is manufactured using a second photolithographic layer.
8. The probe card of claim 1 wherein the first prong is comprised of a first material and the second prong is comprised of a second material.
9. The probe card of claim 1 , wherein the forked bending element is comprised of a nickel alloy.
10. The probe card of claim 1 , wherein the stiffness of the first prong relative to the second prong is selected to achieve a short scrub length.
11. The probe card of claim 1 , wherein the length of the first prong relative to the length of the second prong is selected to achieve a short scrub length.
12. The probe card of claim 1 , wherein the first prong is stiffer than the second prong.
13. The probe card of claim 12 , wherein the stiffness of the first prong is achieved by altering a characteristic of the first prong, wherein the characteristic selected from a group consisting of: geometry, material and combinations thereof.
14. A forked probe for testing a semiconductor device, comprising:
a base that is adapted to be connected to a substrate;
a forked bending element connected to the base, wherein the forked bending element comprises
at least a first prong connected to a second prong through a prong connecting structure, wherein the first and second prongs extend away from the prong connecting structure in a first direction; and
a handle connected to the prong connecting structure, wherein at least a portion of the handle extends away from the prong connecting structure in a second direction that is opposite to the first direction and wherein the portion of the handle connects to the base; and
a probe tip connected to the first prong.
15. The forked probe of claim 14 , wherein the first and second prongs and the handle are adapted to bend such that the prongs and the handle elastically store the displacement energy when the probe tip contacts the device.
16. The probe card of claim 14 further comprising a pivot connected to the second prong.
17. The forked probe of claim 14 , wherein the forked bending element is manufactured using photolithography.
18. The forked probe of claim 14 , wherein the first prong is manufactured using a first photolithographic layer, and the second prong is manufactured using a second photolithographic layer.
19. The forked probe of claim 14 , wherein the first prong is comprised of a first material and the second prong is comprised of a second material.
20. The forked probe of claim 14 , wherein the forked bending element is comprised of a nickel alloy.
21. The forked probe of claim 14 , wherein the stiffness of the first prong relative to the second prong is selected to achieve a short scrub length.
22. The forked probe of claim 14 , wherein the length of the first prong relative to the length of the second prong is selected to achieve a short scrub length.
23. The forked probe of claim 14 , wherein the first prong is stiffer than the second prong.
24. The forked probe of claim 23 , wherein the stiffness of the first prong is achieved by altering a characteristic of the first prong, wherein the characteristic selected from a group consisting of: geometry, material and combinations thereof.