IP Library › Assignment 022619/0478
Patent Assignment
Reel/Frame 022619/0478

Security Agreement

Recorded: 2009-04-30 Received: 2009-04-30 Pages: 27
Assignor
TOUCHDOWN TECHNOLOGIES, INC.
Executed: 2009-04-20
Assignees
MERITECH CAPITAL PARTNERS III L.P.
245 LYTTON AVE., STE. 350, ATTN: MICHAEL GORDON, PALO ALTO, CA, 94301, UNITED STATES
MERITECH CAPITAL AFFILIATES III L.P.
245 LYTTON AVE., STE. 350, ATTN: MICHAEL GORDON, PALO ALTO, CA, 94301, UNITED STATES
FIRSTMARK III, L.P.
1221 AVENUE OF THE AMERICAS, 26TH FLOOR, NEW YORK, NY, 10020, UNITED STATES
FIRSTMARK III OFFSHORE PARTNERS, L.P.
1221 AVENUE OF THE AMERICAS, 26TH FLOOR, NEW YORK, NY, 10020, UNITED STATES
ADAMS CAPITAL MANAGEMENT II, L.P.
500 BLACKBURN AVENUE, SEWICKLEY, PA, 15143, UNITED STATES
ADAMS CAPITAL MANAGEMENT III, L.P.
500 BLACKBURN AVENUE, SEWICKLEY, PA, 15143, UNITED STATES
CHANCELLOR V, L.P.
525 UNIVERSITY AVE., STE. 600, C/O INVESCO PRIVATE CAPITAL, INC., PALO ALTO, CA, 94301, UNITED STATES
CHANCELLOR V-A, L.P.
525 UNIVERSITY AVE., STE. 600, C/O INVESCO PRIVATE CAPITAL, INC., PALO ALTO, CA, 94301, UNITED STATES
CITIVENTURE 2000, L.P.
525 UNIVERSITY AVE., STE. 600, C/O INVESCO PRIVATE CAPITAL, INC., PALO ALTO, CA, 94301, UNITED STATES
E-INVEST LIMITED
29 INTERNATIONAL BUSINESS PARK, #08-05/06 ACER BUILDING TOWER B, SINGAPORE, SGX, 609923, SINGAPORE
FALCON FUND
100 N. BARRANCA STREET, SUITE 910, WEST COVINA, CA, 91791, UNITED STATES
THE ROBERT AND ANNE POCHOWSKI LIVING TRUST DATED MAY 5, 1999
817 LOGAN COURT, ATTN: ROBERT POCHOWSKI, SUNNYVALE, CA, 94087, UNITED STATES
FORT WASHINGTON PRIVATE EQUITY INVESTORS IV, L.P.
303 BROADWAY, SUITE 1200, ATTN: STEPHEN BAKER, CINCINNATI, OH, 45202, UNITED STATES
KENTUCKY CO-INVESTMENT PARTNERS, L.P.
303 BROADWAY, SUITE 1200, ATTN: STEPHEN BAKER, CINCINNATI, OH, 45202, UNITED STATES
J.F. SHEA CO., AS NOMINEE 2000-129
655 BREA CANYON ROAD, WALNUT, CA, 91789, UNITED STATES
3VS1 ASIA GROWTH FUND LTD.
1 COLEMAN STREET, ATTN: MICHAEL MING-YIH WU, #06-05 THE ADELPHIA, SGX, 179803, SINGAPORE
Covered Properties (35)
Microelectronic Wafer Contactor Assembly and Method of Forming the Same
Application: 61/153,731 →
Probe Card Substrate with Bonded Via
Application: 12/077,627 →
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Application: 12/042,295 →
Planarizing Probe Card
Application: 11/953,204 →
Lateral Interposer Contact Design and Probe Card Assembly
Probe Card Assembly and Method of Forming Same
Application: 11/986,453 →
Torsion Spring Probe Contactor Design
Application: 11/983,521 →
Method of Forming Probe Card Assembly
Application: 11/901,014 →
Forked Probe for Testing Semiconductor Devices
Application: 11/855,094 →
Method for Reparing a Microelectromechanical System
Application: 11/778,207 →
Semicoductor Testing Device with Elastomer Interposer
Application: 11/754,818 →
Post and Tip Design for a Probe Contact
Application: 11/796,482 →
Hybrid Probe for Testing Semiconductor Devices
Application: 11/734,434 →
System to Optimize a Semiconductor Probe Card
Application: 11/686,768 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Probe Head with Machine Mounting Pads and Method of Forming Same
Application: 11/641,255 →
Lateral interposer contact design and probe card assembly
Application: 11/633,324 →
Probe Card Assembly
Excess Overdrive Detector for Probe Cards
Application: 11/535,219 →
Lateral Interposer Contact Design and Probe Card Assembly
Probe Card with Balanced Lateral Force
Application: 11/457,132 →
Stacked Contact Bump
Application: 11/421,064 →
Optically Enhanced Probe Alignment
Application: 11/369,343 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Application: 11/346,954 →
Probe Card Assembly
Application: 11/317,408 →
Torsion Spring Probe Contactor Design
Process for Forming Microstructures
Post and Tip Design for a Probe Contact
Lateral interposer contact design and probe card assembly
Application: 11/226,568 →
Torsion Spring Probe Contactor Design
Application: 11/194,801 →
Post and Tip Design for a Probe Contact
Application: 11/194,720 →
Process for Forming Microstructures
Application: 11/102,982 →
Process for Forming Mems
Application: 11/019,912 →
Angled Flying Lead Wire Bonding Process
Application: 10/342,167 →
Selective Methylation Catalyst, Method of Catalyst Manufacture and Methylation Process
Application: 09/771,876 →