Patent Assignment
Reel/Frame 027906/0497
Assignment of Assignor's Interest
Recorded: 2012-03-22
Received: 2012-03-22
Pages: 5
Assignor
TOUCHDOWN TECHNOLOGIES, INC.
Executed: 2012-03-21
Assignee
VERIGY US, INC.
10100 N. TANTAU AVE., CUPERTINO, CA, 95014, UNITED STATES
Covered Properties
(27)
Heteroaryls and Uses Thereof
Application:
13/207,696 →
Multi Material Secondary Metallization Scheme in Mems Fabrication
Application:
12/608,873 →
Multi-Pivot Probe Card For Testing Semiconductor Devices
Application:
12/208,223 →
Probe Card Substrate with Bonded Via
Application:
12/077,627 →
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Application:
12/042,295 →
Planarizing Probe Card
Application:
11/953,204 →
Probe Card Assembly and Method of Forming Same
Application:
11/986,453 →
Torsion Spring Probe Contactor Design
Application:
11/983,521 →
Method of Forming Probe Card Assembly
Application:
11/901,014 →
Forked Probe for Testing Semiconductor Devices
Application:
11/855,094 →
Method for Reparing a Microelectromechanical System
Application:
11/778,207 →
Semicoductor Testing Device with Elastomer Interposer
Application:
11/754,818 →
Post and Tip Design for a Probe Contact
Application:
11/796,482 →
Hybrid Probe for Testing Semiconductor Devices
Application:
11/734,434 →
System to Optimize a Semiconductor Probe Card
Application:
11/686,768 →
Probe Head with Machine Mounting Pads and Method of Forming Same
Application:
11/641,255 →
Excess Overdrive Detector for Probe Cards
Application:
11/535,219 →
Probe Card with Balanced Lateral Force
Application:
11/457,132 →
Stacked Contact Bump
Application:
11/421,064 →
Optically Enhanced Probe Alignment
Application:
11/369,343 →
Probe Head with Machined Mounting Pads and Method of Forming Same
Application:
11/346,954 →
Probe Card Assembly
Application:
11/317,408 →
Torsion Spring Probe Contactor Design
Application:
11/194,801 →
Post and Tip Design for a Probe Contact
Application:
11/194,720 →
Process for Forming Microstructures
Application:
11/102,982 →
Process for Forming Mems
Application:
11/019,912 →
Angled Flying Lead Wire Bonding Process
Application:
10/342,167 →