Multi-Pivot Probe Card For Testing Semiconductor Devices
A novel probe design is presented that comprises a plurality of pivots. These pivots allow the probe to store the displacement energy more efficiently. The novel probe comprises a substrate, and a probe connected to the substrate. The probe further comprises a base that is connected to the substrate, a bending element connected to the base and a probe tip connected to the bending element. In one embodiment, the plurality of pivots may be connected to the substrate such that a portion of the probe may contact the plurality of pivots while the probe tip contacts the device. In another embodiment, the plurality of pivots is connected to the bending element, such that the plurality of pivots may contact the substrate while the probe tip contacts the device. The bending element may also comprise a forked bending element connected to the base, such as the forked bending structure described in co-pending and related patent application Ser. No. 11/855,094. The forked bending structure may include at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure.
1 . A probe card for testing a semiconductor device, comprising:
a substrate;
a probe connected to the substrate, the probe comprising a base that is connected to the substrate, a bending element connected to the base and a probe tip connected to the bending element; and
wherein the probe elastically stores displacement energy while the probe tip contacts the device; and
a plurality of pivots connected to the substrate, wherein a portion of the probe may contact the plurality of pivots while the probe tip contacts the device.
2 . The probe card of claim 1 , wherein the bending element comprises a forked bending element connected to the base, wherein the forked bending element comprises:
at least a first prong connected to a second prong through a prong connecting structure; and
a handle connected to the prong connecting structure.
3 . The probe card of claim 1 wherein the bending element is manufactured using lithography.
4 . The probe card of claim 1 wherein the bending element is manufactured using a first photolithographic layer comprising a first material, and the plurality of pivots is manufactured using a second photolithographic layer comprising a second material.
5 . The probe card of claim 4 wherein the first material has a different Young's Modulus than the second material.
6 . The probe card of claim 1 , wherein the bending element is comprised of a nickel alloy.
7 . The probe card of claim 1 wherein the probe further comprises a probe post connected to the probe tip, wherein the surface of the probe post is manufactured such that the probe post can be optically distinguished from the probe tip.
8 . A probe card for testing a semiconductor device, comprising:
a substrate;
a probe connected to the substrate, the probe comprising a base that is connected to the substrate, a bending element connected to the base and a probe tip connected to the bending element; and
wherein the probe elastically stores displacement energy while the probe tip contacts the device; and
a plurality of pivots connected to the bending element, wherein the plurality of pivots may contact the substrate while the probe tip contacts the device.
9 . The probe card of claim 8 , wherein the bending element comprises a forked bending element connected to the base, wherein the forked bending element comprises:
at least a first prong connected to a second prong through a prong connecting structure; and
a handle connected to the prong connecting structure.
10 . The probe card of claim 8 wherein the bending element is manufactured using lithography.
11 . The probe card of claim 8 wherein the bending element is manufactured using a first photolithographic layer comprising a first material, and the plurality of pivots is manufactured using a second photolithographic layer comprising a second material.
12 . The probe card of claim 11 wherein the first material has a different Young's Modulus than the second material.
13 . The probe card of claim 8 , wherein the bending element is comprised of a nickel alloy.
14 . The probe card of claim 8 wherein the probe further comprises a probe post connected to the probe tip, wherein the surface of the probe post is manufactured such that the probe post can be optically distinguished from the probe tip.