Patent Assignment
Reel/Frame 057219/0246
Assignment of Assignor's Interest
Recorded: 2021-08-18
Pages: 4
Assignor
ADVANTEST AMERICA, INC.
Executed: 2020-11-26
Assignee
FORMFACTOR, INC.
7005 SOUTHFRONT ROAD, LIVERMORE, CALIFORNIA, 94551
Covered Properties
(35)
Angled Flying Lead Wire Bonding Process
Patent:
6,295,729 →
Application:
09/164,470 →
Angled Flying Lead Wire Bonding Process
Process for Forming Mems
Process for Forming Microstructures
Post and Tip Design for a Probe Contact
Torsion Spring Probe Contactor Design
Probe Card Assembly
Probe Head with Machined Mounting Pads and Method of Forming Same
Patent:
7,180,316 →
Application:
11/346,954 →
Optically Enhanced Probe Alignment
Probe Card with Balanced Lateral Force
Excess Overdrive Detector for Probe Cards
Probe Head with Machine Mounting Pads and Method of Forming Same
Hybrid Probe for Testing Semiconductor Devices
Semicoductor Testing Device with Elastomer Interposer
Method for Reparing a Microelectromechanical System
Post and Tip Design for a Probe Contact
Method of Forming Probe Card Assembly
Planarizing Probe Card
Torsion Spring Probe Contactor Design
Probe Card Assembly and Method of Forming Same
Probe for Testing Semiconductor Devices with Features That Increase Stress Tolerance
Probe Card Substrate with Bonded Via
Superfilling Secondary Metallization Process in Mems Fabrication
Multi Material Secondary Metallization Scheme in Mems Fabrication
Probe for Testing Semiconductor Devices
Microelectronic Contactor Assembly, Structures Thereof, and Methods of Constructing Same
Probe Head for a Microelectronic Contactor Assembly, and Methods of Making Same
Probe Head for a Microelectronic Contactor Assembly, the Probe Head Having Smt Electronic Components Thereon
Probecard System and Method
Multi Material Secondary Metallization Scheme in Mems Fabrication
Fine Pitch Microelectronic Contact Array and Method of Making Same
Fine Pitch Probes for Semiconductor Testing, and a Method to Fabricate and Assemble Same
Fine Pitch Probes for Semiconductor Testing, and a Method to Fabricate and Assemble Same
Methods to Manufacture Semiconductor Probe Tips
Patent:
9,678,108 →
Application:
14/178,171 →
Methods to Manufacture Semiconductor Probe Tips
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.