IP Library Granted Patent US 7,759,952
Granted Patent B2
US 7,759,952 · App. 11/901,014 · Granted Jul 20, 2010

Method of forming probe card assembly

Assignee: Touchdown Technologies, Inc.
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Quick Facts
Patent No.
US 7,759,952
App. No.
11/901,014
Filed
Sep 14, 2007
Granted
Jul 20, 2010
Kind
B2
Art Unit
2829
USPC
324/754
Abstract

A probe card assembly has a probe contactor substrate having a plurality of probe contactor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contactor substrate are vertically adjustable until secured by a locking mechanism which is coupled to the probe card wiring board. When the posts are secured in a fixed position, the position is one in which the plane of the plurality of probe contactor substrates is substantially parallel to a predetermined reference plane.

Claims (39)

1. A method of assembling a probe card assembly comprising:

providing a probe card wiring board;

providing a first probe contactor substrate having a first plurality of tips and a second probe contactor substrate having a second plurality of tips;

disposing a sub-mount between the probe card wiring board and the first and second probe contactor substrates;

adjusting a first support structure for the first probe contactor substrate so that a plane of the first plurality of the probe contactor tips is substantially co-planar with a plane of the second plurality of probe contactor tips;

securing an end of the first support structure in a first locked position, wherein the first locked position is one in which a plane of the first plurality of probe contactor tips is co-planar with a plane of the second plurality of probe contactor tips;

vertically adjusting a second support structure for the sub-mount; and

securing an end of the second support structure in a second locked position, wherein the second locked position is one in which a plane of the first plurality of probe contactor tips is substantially parallel to a reference plane.

2. A method of assembling a probe card comprising:

providing a probe card wiring board;

determining a reference plane;

providing a first probe contactor substrate having a first plurality of tips and a second probe contactor substrate having a second plurality of tips;

disposing a sub-mount between the probe card wiring board and the first and second probe contactor substrates;

providing a plurality of support posts for adjusting the first and second probe contactor substrates and the sub-mount;

adjusting a first support post until a plane of the first plurality of probe contactor tips is substantially co-planar with a plane of the second plurality of probe contactor tips;

securing the first support post at a fixed position, wherein the first position is one in which a plane of the first plurality of probe contactor tips is co-planar with a plane of the second plurality of probe contactor tips;

vertically adjusting a second support post for the sub-mount; and

securing an end of the second support post in a second position, wherein the second position is one in which a plane of the first plurality of probe contactor tips is substantially parallel to the predetermined reference plane.

3. The method of claim 2 wherein securing the plurality of support posts includes securing the support post in a lock.

4. The method of claim 3 wherein the lock is coupled to the probe card wiring board.

5. The method of claim 3 wherein the lock is coupled to a stiffener, and the stiffener is coupled to the probe card wiring board.

6. The method of claim 2 wherein the adjusting is accomplished using a micrometer positioner.

7. The method of claim 2 wherein the securing includes applying an adhesive to the support post.

8. The method of claim 2 wherein the securing includes applying a set screw to the support post.

9. The method of claim 2 further including removably coupling the plurality of support post to the first and second probe contactor substrates.

10. A method of assembling a probe card assembly comprising:

coupling a plurality of probe contactors to a plurality of probe contactor substrates;

disposing a sub-mount between a probe card wiring board and the plurality of probe contactor coupled to the plurality of probe contactor substrates;

making the plurality of probe contactors coplanar by adjusting a first plurality of support structures on the plurality of probe contactor substrates;

fixedly securing the plurality of support structures in a first plurality of locks;

vertically adjusting a second plurality of support structures for the sub-mount; and

securing the second plurality of support structures in a second plurality of locks, wherein the second plurality of locks fixedly secure the plurality of probe contactors substantially parallel to a reference plane.

11. A method of assembling a probe card comprising:

aligning a sub-mount having a plurality of locks thereon such that it is aligned to a glass mask having a plurality of fiducial marks thereon;

aligning a diagonally opposed first contactor tip pattern on a first probe contactor substrate to a first pattern of the plurality of fiducial marks on the glass mask;

fixedly securing a first plurality of support posts on the first probe contactor substrate to at least a first portion of the plurality of locks;

aligning a diagonally opposed second contactor tip pattern on a second probe contactor substrate to a second pattern of the plurality of fiducial marks on the glass mask;

fixedly securing a second plurality of support posts on the second probe contactor substrate to at least a second portion of the plurality of locks.

12. The method of claim 3 , wherein the lock includes a collet.

Assignments (9)
SECURITY INTEREST Recorded Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: ADVANTEST AMERICA, INC.
To: FORMFACTOR, INC.
Reel/Frame 057219/0246 →
CHANGE OF NAME Recorded Apr 17, 2012
From: VERIGY US, INC
To: ADVANTEST AMERICA, INC
Reel/Frame 028054/0852 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2012
From: TOUCHDOWN TECHNOLOGIES, INC.
To: VERIGY US, INC.
Reel/Frame 027906/0497 →
CHANGE OF NAME Recorded Jul 27, 2009
From: LAKE ACQUISITION, INC.
To: TOUCHDOWN TECHNOLOGIES, INC.
Reel/Frame 023003/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2009
From: TOUCHDOWN TECHNOLOGIES, INC.
To: LAKE ACQUISITION, INC.
Reel/Frame 022868/0913 →
RELEASE OF SECURITY INTEREST Recorded Jun 16, 2009
From: MERITECH CAPITAL PARTNERS III L.P.; MERITECH CAPITAL AFFILIATES III L.P.; FIRSTMARK III, L.P.; FIRSTMARK III OFFSHORE PARTNERS, L.P.; ADAMS CAPITAL MANAGEMENT II, L.P.; ADAMS CAPITAL MANAGEMENT III, L.P.; CHANCELLOR V, L.P.; CHANCELLOR V-A, L.P.; CITIVENTURE 2000, L.P.; E-INVEST LIMITED; FALCON FUND; THE ROBERT AND ANNE POCHOWSKI LIVING TRUST DATED MAY 5, 1999; FORT WASHINGTON PRIVATE EQUITY INVESTORS IV, L.P.; KENTUCKY CO-INVESTMENT PARTNERS, L.P.; J.F. SHEA CO., AS NOMINEE 2000-129; 3VS1 ASIA GROWTH FUND LTD.
To: TOUCHDOWN TECHNOLOGIES, INC.
Reel/Frame 022824/0902 →
SECURITY AGREEMENT Recorded Apr 30, 2009
From: TOUCHDOWN TECHNOLOGIES, INC.
To: MERITECH CAPITAL PARTNERS III L.P.; MERITECH CAPITAL AFFILIATES III L.P.; FIRSTMARK III, L.P.; FIRSTMARK III OFFSHORE PARTNERS, L.P.; ADAMS CAPITAL MANAGEMENT II, L.P.; ADAMS CAPITAL MANAGEMENT III, L.P.; CHANCELLOR V, L.P.; CHANCELLOR V-A, L.P.; CITIVENTURE 2000, L.P.; E-INVEST LIMITED; FALCON FUND; THE ROBERT AND ANNE POCHOWSKI LIVING TRUST DATED MAY 5, 1999; FORT WASHINGTON PRIVATE EQUITY INVESTORS IV, L.P.; KENTUCKY CO-INVESTMENT PARTNERS, L.P.; J.F. SHEA CO., AS NOMINEE 2000-129; 3VS1 ASIA GROWTH FUND LTD.
Reel/Frame 022619/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2007
From: GARABEDIAN, RAFFI; TEA, NIM HAK; WANG, STEVEN; KARKLIN, HEATHER
To: TOUCHDOWN TECHNOLOGIES, INC.
Reel/Frame 019877/0691 →
Continuity (2)
Division 1131740800 · Dec 22, 2005
Related Publication 20080007281A1 · Jan 10, 2008