Megasonic cleaning using supersaturated solution
View Patent ↗A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.
1. A method of cleaning at least one semiconductor wafer comprising:
(a) positioning a semiconductor wafer in a process chamber;
(b) supplying a solution to the process chamber so as to contact the substrate, the solution comprising a cleaning liquid and a first and second gases dissolved in the cleaning liquid, wherein the first gas promotes particle removal from the wafer and the second gas protects the wafer from damage resulting from acoustical energy; and
(c) applying acoustical energy through the solution and to the wafer to clean the wafer;
wherein the second gas is carbon dioxide and the process chamber comprises a gaseous environment at a first temperature and a first partial pressure of carbon dioxide, the carbon dioxide dissolved in the cleaning liquid at a supersaturated concentration for the first temperature and the first partial pressure.
2. The method of claim 1 wherein the first gas is selected from the group consisting of nitrogen, oxygen, helium, and argon.
3. The method of claim 1 further comprising:
prior to step b), dissolving the carbon dioxide in the liquid in an environment having a second temperature and a second partial pressure of carbon dioxide, wherein the carbon dioxide is dissolved in an amount such that the carbon dioxide is at or below a saturation concentration for the second temperature and second partial pressure.
4. The method of claim 3 wherein step (c) is completed before enough of the carbon dioxide escapes from the solution to lower the concentration of the carbon dioxide dissolved in the liquid to a saturation concentration for the first temperature and first partial pressure.