Patent Assignment
Reel/Frame 045097/0070
Termination and Release of Trademark and Patent Security Agreement Recorded at Reel 21744/Frame 0209 and Reel 21731/Frame 0608
Recorded: 2018-01-19
Received: 2018-01-19
Pages: 13
Assignor
PNC BANK, NATIONAL ASSOCIATION
Executed: 2018-01-16
Assignee
WAFER HOLDINGS, INC.
6330 HEDGEWOOD DRIVE, SUITE 150, ALLENTOWN, PA, 18106, UNITED STATES
Covered Properties
(59)
Acoustic Generating Device
Application:
61/034,142 →
Method for cleaning substrates utilizing surface passivation and/or oxide layer growth to protect from pitting
Application:
12/070,620 →
Method and System for Processing a Substrate Using a Composite Transmitter
Application:
60/985,947 →
Method of Cleaning Substrates Utilizing Megasonic Energy
Application:
11/873,750 →
System and Method for Processing a Substrate Utilizing a Gas Stream for Particle Removal
Application:
11/841,427 →
System for Megasonic Processing of an Article
Application:
11/839,885 →
Apparatus and Method of Measuring Acoustical Energy Applied to a Substrate
Application:
11/837,292 →
Apparatus for Ejecting Fluid Onto a Substrate and System and Method Incorporating the Same
Application:
11/781,835 →
Transducer Assembly Incorporating a Transmitter Having Through Holes, and Method and System for Cleaning a Substrate Utilizing the Same
Application:
11/777,252 →
Combinatorial Coding/Decoding for Electrical Computers and Digital Data Processing Systems
Application:
11/777,256 →
Apparatus and Method for Processing a Hydrophobic Surface of a Substrate
Application:
11/755,619 →
Spray Jet Cleaning Apparatus and Method
Application:
11/745,866 →
System and Method for Selective Etching of Silicon Nitride During Substrate Processing
Application:
10/585,229 →
System Apparatus and Methods for Processing Substrates Using Acoustic Energy
Application:
11/625,651 →
Acoustic Energy System, Method and Apparatus for Processing Flat Articles
Application:
11/625,556 →
Systems and Methods for Drying a Rotating Substrate
Application:
11/624,445 →
Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing
Application:
11/649,535 →
Reciprocating megasonic probe
Application:
11/640,718 →
Megasonic Cleaning Using Supersaturated Solution
Application:
11/595,029 →
System and method of cleaning substrates using a subambient process solution
Application:
11/544,802 →
System and method of processing substrates using sonic energy having cavitation control
Application:
11/454,447 →
Apparatus for Megasonic Processing of an Article
Application:
11/386,634 →
Transducer Assembly for Magasonic Processing of an Article and Apparatus Utilizing the Same
Application:
11/375,907 →
Membrane Dryer
Application:
10/951,009 →
Process Sequence for Photoresist Stripping and/or Cleaning of Photomasks for Integrated Circuit Manufacturing
Application:
10/909,764 →
System and Method for Point-of-Use Filtration and Purification of Fluids Used in Substrate Processing
Application:
10/895,511 →
Megasonic Cleaning Using Supersaturated Cleaning Solution
Application:
10/864,929 →
Megasonic Cleaner and Dryer
Application:
10/864,927 →
Apparatus and Methods for Reducing Damage to Substrates During Megasonic Cleaning Processes
Application:
10/760,596 →
Sonic-Energy Cleaner System with Gasified Fluid
Application:
10/742,214 →
Method of Cleaning a Side of a Thin Flat Substrate by Applying Sonic Energy to the Opposite Side of the Substrate
Application:
10/726,774 →
Substrate Process Tank with Acoustical Source Transmission and Method of Processing Substrates
Application:
10/699,042 →
Method for Removal of Photoresist Using Sparger
Application:
10/634,440 →
Process and Apparatus for Removal of Photoresist from Semiconductor Wafers Using Spray Nozzles
Application:
10/366,054 →
Capillary Drying of Substrates
Application:
10/358,636 →
Megasonic Cleaning System with Buffered Cavitation Method
Application:
10/341,425 →
Method of Processing Substrates Using Pressurized Mist Generation
Application:
10/304,583 →
Wafer Cleaning
Application:
10/243,463 →
Wafer Cleaning
Application:
10/243,486 →
Stackable Process Chambers
Application:
10/171,429 →
Megasonic Cleaner and Dryer System
Application:
10/171,430 →
Megasonic Cleaner and Dryer
Application:
10/171,426 →
Reciprocating Megasonic Probe
Application:
10/140,029 →
Device and Method for Cleaning Substrates
Application:
10/111,332 →
Chemical Concentration Control Device
Application:
10/117,725 →
Process Tank with Pressurized Mist Generation
Application:
10/117,768 →
Nextgen Wet Process Tank
Application:
10/117,778 →
Membrane Dryer
Application:
10/117,739 →
Drying Vapor Generation
Application:
10/098,847 →
Cleaning and Drying Method and Apparatus
Application:
10/091,011 →
Dump Door
Application:
10/085,565 →
Megasonic Probe Energy Director
Application:
10/059,682 →
Method and System for Chemical Injection in Silicon Wafer Processing
Application:
10/053,364 →
Low Profile Wafer Carrier
Application:
10/053,449 →
System for Removal of Photoresist Using Sparger
Application:
10/052,823 →
Device and Method for Processing Substrates
Application:
09/869,213 →
Wafer Cleaning Method
Application:
09/953,504 →
Megasonic Probe Energy Attenuator
Application:
09/922,509 →
Megasonic Cleaner Probe System with Gasified Fluid
Application:
09/906,384 →