IP Library Granted Patent US 7,938,131
Granted Patent B2
US 7,938,131 · App. 11/781,835 · Granted May 10, 2011

Apparatus for ejecting fluid onto a substrate and system and method incorporating the same

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Quick Facts
Patent No.
US 7,938,131
App. No.
11/781,835
Granted
May 10, 2011
Kind
B2
Abstract

A fluid dispenser for use in the processing of substrates. The dispenser has a dome shaped body with a convex upper surface and has a number of conduits designed to supply fluid to the surface of a substrate at predetermined points.

Claims (29)

1. A system for processing substrates comprising:

a rotatable support for supporting and rotating a substrate about a rotational center-point;

a liquid dispensing apparatus comprising a body with a substantially dome-shaped outer surface, a first angled conduit terminating as a first hole in the outer surface of the body and a second conduit terminating as a second hole in the outer surface of the body; and

wherein the first hole is offset a radial distance from the rotational center-point of the substrate, the first angled conduit oriented to eject liquid out of the first hole into contact with the surface of the substrate at or near the rotational center-point, the second conduit oriented and positioned to eject liquid out of the second hole into contact with the surface of the substrate at a first radial distance from the rotational center-point;

a first header and a second header;

the first and second conduits forming a first array of conduits fluidly coupled to the first header;

a second array of conduits fluidly coupled to the second header;

the outer surface of the body comprising a longitudinal center-line;

the first and second holes located on one side of the longitudinal center-line and the second array of the conduits terminating in holes in the outer surface of the body located on the other side of the longitudinal center-line; and

wherein the conduits of the first and second arrays are positioned and oriented to eject liquid into contact with the surface of the substrate at locations intersected by a longitudinal center plane of the body.

2. A system for processing substrates comprising:

a rotatable support for supporting and rotating a substrate about a rotational center-point; and

a fluid dispensing apparatus comprising a body, a first header and a second header;

the first header having an inlet adapted to introduce a first fluid into the first header;

the second header having an inlet adapted to introduce a second fluid into the second header;

a first array of conduits extending from the first header and terminating as holes in an outer surface of the body, the first array of conduits adapted to eject the first fluid from the first header and onto a substrate located on the rotatable support; and

a second array of conduits extending from the second header and terminating as holes in the outer surface of the body, the second array of conduits adapted to eject the second fluid from the second header and onto a substrate located on the rotatable support;

the body comprising a longitudinal center plane;

the first array of conduits located on one side of the longitudinal center plane and the second array of conduits located on the other side of the longitudinal center plane; and

wherein the conduits of the first and second arrays are positioned and oriented to eject fluid into contact with a surface of the substrate at locations intersected by the longitudinal center plane of the body.

3. An apparatus for applying a liquid to a surface of a substrate comprising:

a body having a first header and a second header;

a first inlet for introducing a first fluid into the first header;

a second inlet for introducing a second fluid into the second header;

a first array of conduits extending from the first header and terminating as holes in an outer surface of the body, the first array of conduits adapted to eject the first fluid; and

a second array of conduits extending form the second header and terminating as holes in the outer surface of the body, the second array of conduits adapted to eject the second fluid;

the body comprising a longitudinal center plane;

the first array of conduits located on one side of the longitudinal center plane and the second array of conduits located on the other side of the longitudinal center plane; and

wherein the conduits of the first and second arrays are positioned and oriented to eject fluid into contact with the surface of the substrate at locations intersected by the longitudinal center plane of the body.

Assignments (14)
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 23220/FRAME 0423 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0189 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 22973/FRAME 0811 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0288 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 021731/FRAME 0718 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: WAFER HOLDINGS, INC.
Reel/Frame 045103/0624 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2018
From: AKRION SYSTEMS LLC
To: NAURA AKRION INC.
Reel/Frame 045097/0140 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 21744/FRAME 0209 AND REEL 21731/FRAME 0608 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: WAFER HOLDINGS, INC.
Reel/Frame 045097/0070 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2009
From: HAHN, CHRISTOPHER; LEE, HANJOO
To: AKRION, INC.
Reel/Frame 023239/0038 →
SECURITY AGREEMENT Recorded Sep 14, 2009
From: AKRION SYSTEMS LLC
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 023220/0423 →
SECURITY AGREEMENT Recorded Jul 20, 2009
From: AKRION SYSTEMS, LLC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 022973/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2009
From: WAFER HOLDINGS, INC.; AKRION TECHNOLOGIES, INC.
To: AKRION SYSTEMS LLC
Reel/Frame 022824/0970 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 021731/0718 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021731/0608 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021744/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2008
From: PNC BANK, NATIONAL ASSOCIATION; BHC INTERIM FUNDING II, L.P.; AKRION, INC.; GOLDFINGER TECHNOLOGIES, LLC; AKRION TECHNOLOGIES, INC.; SCP SERVICES, INC. (F/K/A AKRION SCP ACQUISITION CORP.)
To: WAFER HOLDINGS, INC.
Reel/Frame 021658/0928 →
SECURITY AGREEMENT Recorded Sep 1, 2008
From: AKRION TECHNOLOGIES, INC.
To: SUNRISE CAPITAL PARTNERS, L.P.
Reel/Frame 021462/0283 →