Megasonic cleaning system with buffered cavitation method
View Patent ↗A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.
1. A method for cleaning a fine-structured object, the method comprising:
generating a first signal, the first signal at a first frequency;
generating a second signal, the second signal having a second frequency less than the first frequency;
generating a third signal, the third signal having a quasi-direct voltage bias and a third frequency less than the second frequency;
generating a combined signal, the combined signal comprising a combination of the first signal, the second signal, and the third signal; and
providing the combined signal to a transducer system, the transducer system converting the combined signal to an acoustic field, said acoustic field applied to die object to be cleaned.
2. The method of claim 1 , wherein the method further includes:
adjusting the timing of the second frequency signal through a first trigger;
adjusting the amplitude of the second frequency signal through a first preamplifier; and
buffering micro bubble growth while increasing micro bubble formation through at least one of the adjustment of the first trigger and adjustment of the first preamplifier.
3. The method of claim 2 , where the buffering is accomplished in real-time.
4. The method of claim 1 , wherein the method further includes:
adjusting the timing of the third frequency signal through a second trigger;
adjusting the amplitude of the third frequency signal through a second preamplifier; and
buffering micro bubble growth while increasing micro bubble formation through at least
one of the adjustment of the second trigger and adjustment of the second preamplifier.
5. The method of claim 4 , where the buffering is accomplished in real-time.
6. The method of claim 1 , wherein the method further includes:
generating the second signal to be a step wave.
7. The method of claim 1 , wherein the method further includes:
adjusting a bias of the third signal to increase the regions of positive pressure relative to the regions of negative pressure in the acoustic field applied to the object to be cleaned.
8. The method of claim 1 , wherein the method further includes:
controlling the timing and amplitude of the second signal in real time.
9. The method of claim 1 , wherein the method further includes:
controlling the timing and amplitude of the third signal in real time.
10. A method for cleaning an object comprising combining a first higher frequency megasonic signal and a second lower frequency megasonic signal into a combined signal;
applying the combined signal to a transducer system, the transducer system converting the combined signal into acoustic waves;
creating microcavitation through regions of negative pressure in the acoustic waves;
buffering microcavitation through regions of positive pressure in the acoustic waves;
applying the acoustic wave to the object to be cleaned in a cleaning fluid; and adding a quasi-direct voltage bias signal having a frequency less than the frequency of the second megasonic signal to the combined signal.
11. The method of claim 10 further comprising adjusting at least one of a period and an amplitude of the combined signal to buffer micro-bubble growth.
12. The method of claim 10 , further comprising adjusting at least one of a period and an amplitude of the bias signal to buffer micro-bubble growth.