Patent Assignment
Reel/Frame 017961/0645
Security Agreement
Recorded: 2006-07-19
Received: 2006-07-19
Pages: 28
Assignor
AKRION TECHNOLOGIES, INC.
Executed: 2006-06-15
Assignee
PNC BANK, NATIONAL ASSOCIATION
100 WEST ROAD, SUITE 327, TOWSON, MD, 21204, UNITED STATES
Covered Properties
(52)
Apparatus for Megasonic Processing of an Article
Application:
11/386,634 →
Transducer Assembly for Magasonic Processing of an Article and Apparatus Utilizing the Same
Application:
11/375,907 →
Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
Application:
11/370,707 →
Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
Application:
11/370,361 →
Backside cleaning of substrates
Application:
60/760,820 →
System and method for drying a rotating substrate
Application:
60/759,948 →
Apparatus and Method for Removing Trace Amounts of Liquid from Substrates During Single-Substrate Processing
Application:
11/266,402 →
System and method of processing substrates using a sub-ambient process solution and sonic energy
Application:
60/724,495 →
System and method of powering a sonic energy source and use of the same to process substrates
Application:
11/227,705 →
Reduced pressure irradiation processing method and apparatus
Application:
11/178,923 →
Method and apparatus for creating ozonated process solutions having high ozone concentration
Application:
11/177,147 →
System and method for pre-gate cleaning of substrates
Application:
11/176,406 →
System and method of cleaning substrates using high frequency megasonics and/or cavitation control
Application:
60/690,586 →
Membrane Dryer
Application:
10/951,009 →
Megasonic processing system with gasified fluid
Application:
10/931,457 →
Apparatus for carrying reticles and method of using the same to process reticles
Application:
10/931,441 →
Process Sequence for Photoresist Stripping and/or Cleaning of Photomasks for Integrated Circuit Manufacturing
Application:
10/909,764 →
System and Method for Point-of-Use Filtration and Purification of Fluids Used in Substrate Processing
Application:
10/895,511 →
Megasonic Cleaning Using Supersaturated Cleaning Solution
Application:
10/864,929 →
Megasonic cleaner and dryer
Application:
10/865,440 →
Megasonic Cleaner and Dryer
Application:
10/864,927 →
Apparatus and Methods for Reducing Damage to Substrates During Megasonic Cleaning Processes
Application:
10/760,596 →
Sonic-Energy Cleaner System with Gasified Fluid
Application:
10/742,214 →
Method of Cleaning a Side of a Thin Flat Substrate by Applying Sonic Energy to the Opposite Side of the Substrate
Application:
10/726,774 →
Substrate Process Tank with Acoustical Source Transmission and Method of Processing Substrates
Application:
10/699,042 →
Method for Removal of Photoresist Using Sparger
Application:
10/634,440 →
Process and Apparatus for Removal of Photoresist from Semiconductor Wafers Using Spray Nozzles
Application:
10/366,054 →
Capillary Drying of Substrates
Application:
10/358,636 →
Megasonic Cleaning System with Buffered Cavitation Method
Application:
10/341,425 →
Method of Processing Substrates Using Pressurized Mist Generation
Application:
10/304,583 →
Wafer Cleaning
Application:
10/243,463 →
Method of recycling cement kiln dust
Application:
10/234,486 →
Megasonic cleaner and dryer system
Application:
10/171,494 →
Stackable Process Chambers
Application:
10/171,429 →
Megasonic Cleaner and Dryer System
Application:
10/171,430 →
Method of applying liquid to a megasonic apparatus for improved cleaning control
Application:
10/171,431 →
Megasonic Cleaner and Dryer
Application:
10/171,426 →
Reciprocating Megasonic Probe
Application:
10/140,029 →
Chemical Concentration Control Device
Application:
10/117,725 →
Process Tank with Pressurized Mist Generation
Application:
10/117,768 →
Nextgen Wet Process Tank
Application:
10/117,778 →
Membrane Dryer
Application:
10/117,739 →
Drying Vapor Generation
Application:
10/098,847 →
Cleaning and Drying Method and Apparatus
Application:
10/091,011 →
Megasonic Probe Energy Director
Application:
10/059,682 →
Method and System for Chemical Injection in Silicon Wafer Processing
Application:
10/053,364 →
Low Profile Wafer Carrier
Application:
10/053,449 →
System for Removal of Photoresist Using Sparger
Application:
10/052,823 →
Particle Barrier Drain
Application:
10/014,121 →
Wafer Cleaning Method
Application:
09/953,504 →
Megasonic Probe Energy Attenuator
Application:
09/922,509 →
Megasonic Cleaner Probe System with Gasified Fluid
Application:
09/906,384 →