Nextgen wet process tank
View Patent ↗A process tank for processing a plurality of wafers having a diameter, the process tank comprising: two substantially vertical side walls being a first distance apart; wherein the first distance is substantially equal to the diameter of the wafer; two upwardly angled walls positioned between the side walls; a first transducer array coupled to a first of the upwardly angled walls, the first transducer array extending a length less than the diameter of the wafer; and a second transducer array coupled to a second of the upwardly angled walls, the second transducer array extending a length less than the diameter of the wafer. It is preferred that the process tank further comprise a fluid inlet positioned between the upwardly angled walls. In another aspect, the invention is a method of processing wafers comprising: filling the process tank described above with a wafer processing liquid through the tank inlet; submerging a wafer carrier holding a plurality wafers into the tank; and applying megasonic energy to the liquid through the first and second transducer arrays for a predetermined time and in a predetermined pattern.
1. A process tank for processing a plurality of wafers having a diameter, the process tank comprising:
two substantially vertical side walls being a first distance apart;
wherein the first distance is substantially equal to the diameter of the wafer;
two upwardly angled walls positioned between the side walls;
a first transducer array coupled to a first of the upwardly angled walls, the first transducer array extending a length less than the diameter of the wafer; and
a second transducer array coupled to a second of the upwardly angled walls, the second transducer array extending a length less than the diameter of the wafer.
2. The tank of claim 1 comprising a fluid inlet positioned between the upwardly angled walls.
3. The tank of claim 2 wherein the inlet is approximately one-fourth the diameter of the wafer.
4. The tank of claim 2 wherein the inlet is has an hourglass-shaped side profile.
5. The tank of claim 1 wherein neither the first nor second transducer arrays, individually or in combination with one another, provide direct megasonic energy to the entire surface area of wafers placed in the tank.
6. The tank of claim 1 wherein the lengths of the first and second transducer arrays are within the range of one-fourth to three-fourths the diameter of the wafers.
7. The tank of claim 1 wherein the lengths of the first and second transducer arrays are about ½ the diameter of the wafer.
8. The tank of claim 1 wherein the first and second upwardly angled walls are 45 degrees from horizontal.
9. The tank of claim 8 wherein the lengths of the first and second transducer arrays are about ½ the diameter of the wafer.
10. The tank of claim 1 wherein the two upwardly angled walls and the first and second transducer arrays are substantially linear.
11. The tank of claim 1 wherein the upwardly angled walls are positioned between the side walls at a height so that when a wafer is uprightly positioned in the tank so that the top of the wafer is just below the top of the side walls, the wafers nearly contact the first and second transducer surfaces.
12. The tank of claim 11 wherein the wafers are within 0.1-1 inch of the first and second transducer surfaces.
13. The tank of claim 1 comprising a re-circulation loop.
14. The tank of claim 13 wherein the re-circulation loop comprises a weir and at least one quick dump valve.
15. The tank of claim 1 wherein the first and second transducer arrays are respectively connected to the upper surface of the first and second upwardly angled walls.
16. The tank of claim 1 comprising substantially vertical back and front walls being a second distance apart wherein the second distance is substantially equal to length of a wafer carrier adapted to carry a plurality of wafers.
17. The tank of claim 1 wherein the tank is adapted for rinsing wafers after chemical processing and also drying wafers after rinsing.
18. The tank of claim 1 comprising means to measure the chemical concentration of a processing liquid.
19. The tank of claim 1 comprising a lid.
20. A method of processing wafers comprising:
filling the tank of claim 2 with a wafer processing liquid through the tank inlet;
submerging a wafer carrier holding a plurality wafers into the tank; and
applying megasonic energy to the liquid through the first and second transducer arrays for a predetermined time and in a predetermined pattern.
21. The method of claim 20 wherein the plurality of wafers are uprightly positioned in the wafer carrier and the wafer carrier is submerged so that the diameter of the wafers are substantially perpendicular to the side walls.
22. The method of claim 20 comprising continuously supplying the wafer processing liquid through the inlet for a predetermined time after the wafers are submerged in the liquid filled tank so that the liquid overflows the side walls.
23. The method of claim 20 comprising capturing the overflowed liquid and recirculating the overflowed liquid back through the tank via pump, filters, heater, concentration sensors.
24. The method of claim 20 wherein the wafer processing liquid is deionized water, hydrofluoric acid, ammonium hydroxide, hydrogen peroxide, hydrochloric acid, sulfuric acid, ozone, carbon dioxide, or a combination thereof.