IP Library Patent Application 11777252
Patent Application
App. No. 11/777,252

TRANSDUCER ASSEMBLY INCORPORATING A TRANSMITTER HAVING THROUGH HOLES, AND METHOD AND SYSTEM FOR CLEANING A SUBSTRATE UTILIZING THE SAME

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Patent No.
US None
App. No.
11/777,252
Abstract

An apparatus, system and method for processing a substrate utilizing sonic energy. In one aspect, the invention utilizes a transmitter having through holes to dampen sonic energy that may damage the substrate. In other aspects, the through holes of the transmitter can be adapted to introduce a liquid solution having bubbles of a controlled size into the meniscus that couples the transmitter to the surface of a substrate to be cleaned to further dampen the sonic energy. IN one embodiment, the invention is a system for processing a substrate comprising: a rotary support for supporting a substrate in a substantially horizontal orientation; a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy, the transducer acoustically coupled to the transmitter; a plurality of internal passageways extending through the transmitter from holes in a first outer surface of the transmitter to holes in a second outer surface of the transmitter; and the transducer assembly positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a substrate on the rotary support so that when a liquid is applied to the surface of the substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate.

Claims (87)

1 . A system for processing a substrate comprising:

a rotary support for supporting a substrate in a substantially horizontal orientation;

a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy, the transducer acoustically coupled to the transmitter;

a plurality of internal passageways extending through the transmitter from holes in a first outer surface of the transmitter to holes in a second outer surface of the transmitter; and

the transducer assembly positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a substrate on the rotary support so that when a liquid is applied to the surface of the substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate.

2 . The system of claim 1 wherein the sonic energy generated by the transducer is transmitted through the transmitter along a transmission path; and wherein the internal passageways pass transversely through the transmission path.

3 . The system of claim 1 wherein the transmitter is constructed of quartz or sapphire.

4 . The system of claim 1 wherein the portion of the transmitter comprises the holes in the second outer surface.

5 . The system of claim 4 further comprising a source of a fluid operably connected to the holes in the first outer surface so that the fluid can be supplied through the passageways.

6 . The system of claim 5 wherein the fluid comprises a liquid and a dissolved gas.

7 . The system of claim 6 wherein the fluid comprises bubbles, the bubbles having a size between 0.3 μm to 3.0 μm in diameter.

8 . The system of claim 1 further comprising:

the transmitter being an elongated transmitter having an axis, the transducer acoustically coupled to the transmitter so that sonic energy is transmitted through the transmitter along the axis; and

the internal passageways passing transversely through the axis.

9 . The system of claim 8 wherein the elongated transmitter is a rod-like transmitter.

10 . The system of claim 1 wherein the internal passageways are substantially linear.

11 . The system of claim 10 wherein the internal passageways are substantially parallel to one another.

12 . The system of claim 1 wherein the internal passageways have a diameter in the range between 0.1 μm to 5.0 μm.

13 . The system of claim 1 further comprising:

a dispenser operably connected to a source of the liquid, the dispenser positioned to apply the film of the liquid on the substrate;

a source of a fluid comprising a liquid and a gas, the fluid comprising bubbles; and

the source of the fluid operably connected to the holes in the first surface of the transmitter.

14 . A system for processing a substrate comprising:

a rotary support for supporting a substrate in a substantially horizontal orientation;

a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy, the transducer acoustically coupled to the transmitter;

the transducer assembly positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a substrate on the rotary support so that when a liquid is applied to the surface of the substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate;

a plurality of holes in the portion of the transmitter, the holes extending into the transmitter as internal passageways that are adapted to be operably connected to a source of fluid.

15 . The system of claim 14 further comprising a dispenser operably connected to a source of the liquid, the dispenser positioned to apply the film of the liquid on the substrate.

16 . The system of claim 14 further comprising a source of the fluid operably connected to the internal passageways.

17 . The system of claim 16 wherein the fluid comprises a liquid and a dissolved gas.

18 . The system of claim 17 wherein the fluid comprises bubbles having a size between 0.3 μm to 3.0 μm in diameter.

19 . The system of claim 14 wherein the sonic energy generated by the transducer is transmitted through the transmitter along a transmission path; and wherein the holes extend into the transmitter as internal passageways that are transverse to the transmission path.

20 . The system of claim 14 wherein the transmitter is constructed of quartz or sapphire.

21 . The system of claim 14 further comprising:

the transmitter being an elongated transmitter having an axis, the transducer acoustically coupled to the transmitter so that sonic energy is transmitted through the transmitter along the axis; and

the internal passageways being oriented transverse to the axis.

22 . The system of claim 14 wherein the internal passageways are substantially linear and substantially parallel to one another.

23 . The system of claim 14 wherein the holes have a diameter in the range between 0.1 μm to 5.0 μm.

24 . The system of claim 14 further comprising a depressor for generating bubbles in a fluid supplied to the internal passageways.

25 . A system for processing substrates comprising:

a rotary support for supporting a substrate;

a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy, the transducer acoustically coupled to the transmitter;

the transducer assembly positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a substrate on the rotary support so that when a liquid is applied to the surface of the substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate;

a plurality of holes in an outer surface of the transmitter, the holes extending into the transmitter as internal passageways that are adapted to be operably connected to a source of fluid.

26 . The system of claim 25 further comprising a depressor for generating bubbles in a fluid supplied to the internal passageways.

27 . A transducer assembly comprising:

a transducer adapted to generate sonic energy;

a transmitter, the transducer acoustically coupled to the transmitter;

a plurality of holes in an outer surface of the transmitter, the holes extending into the transmitter as internal passageways that are adapted to be operably connected to a source of fluid.

28 . The transducer assembly of claim 27 wherein the transducer assembly is adapted to be positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a rotating substrate so that when a liquid is applied to the surface of the rotating substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate;

29 . The transducer assembly of claim 27 further comprising:

the transmitter being an elongated transmitter having an axis, the transducer acoustically coupled to the transmitter so that sonic energy is transmitted through the transmitter along the axis; and

the internal passageways being oriented transverse to the axis.

30 . The transducer assembly of claim 27 wherein the sonic energy generated by the transducer is transmitted through the transmitter along a transmission path; and wherein the internal passageways pass transversely through the transmission path

31 . A transducer assembly comprising:

a transducer adapted to generate sonic energy;

a transmitter, the transducer acoustically coupled to the transmitter; and

a plurality of internal passageways extending through the transmitter from holes in a first outer surface of the transmitter to holes in a second outer surface of the transmitter.

32 . The transducer assembly of claim 31 wherein the sonic energy generated by the transducer is transmitted through the transmitter along a transmission path; and wherein the internal passageways pass transversely through the transmission path

33 . A method of processing a substrate comprising:

supporting a substrate in a substantially horizontal orientation;

rotating the substrate;

providing a transducer assembly comprising a transducer adapted to generate sonic energy and a transmitter, the transducer acoustically coupled to the transmitter, and a plurality of holes in an outer surface of the transmitter, the holes extending into the transmitter as internal passageways that are adapted to supply a fluid;

applying a liquid to a surface of the substrate so as to form a meniscus of the liquid that couples a portion of the transmitter to the surface of the substrate;

applying sonic energy to the surface of the substrate via the transmitter; and

applying fluid into the meniscus via the holes in the outer surface of the transmitter.

34 . The method of claim 33 wherein the fluid comprises a liquid and gas bubbles.

35 . The method of claim 34 wherein the gas bubbles have a size between 0.3 μm to 3.0 μm in diameter.

37 . The method of claim 33 wherein the holes have a diameter in a range between 0.1 μm to 5.0 μm.

38 . The method of claim 33 wherein the transmitter overlay less than 100% of the surface of the wafer.

39 . The method of claim 33 wherein the transmitter is an elongate transmitter.

40 . A method of processing a substrate comprising:

a) supporting a substrate in a substantially horizontal orientation;

b) rotating the substrate;

c) providing a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy having a frequency, the transducer acoustically coupled to the transmitter;

d) applying sonic energy to the surface of the substrate via the transmitter, the sonic energy having a field; and

e) applying a liquid with bubbles to the surface of the substrate in the sonic energy field so that the bubbles dampen the sonic energy reaching the surface of the substrate, the bubbles having a predetermined size correlating to the frequency of the sonic energy.

41 . The method of claim 40 wherein the frequency of the sonic energy is in a range between 600 kHz to 1100 KHz and the predetermined size of the bubbles is in a range of 0.3 μm to 3.0 μm in diameter.

42 . The method of claim 40 wherein step e) further comprises flowing the liquid with bubbles through the transmitter and into a meniscus of liquid that couples a portion of the transmitter to the surface of the substrate.

43 . The method of claim 42 wherein step e) further comprises flowing the liquid with bubbles through the transmitter via a plurality of internal passageways within the transmitter, the internal passageways sized to control the size of the bubbles to the predetermined size.

45 . The method of claim 40 further comprising generating the bubbles within the liquid prior to application to the substrate.

46 . The method of claim 45 wherein the bubble generation step comprises dissolving a gas into a liquid in a pressurized chamber so as to form a solution, flowing the solution out of the pressurized chamber, and depressurizing the solution prior to application to the surface of the substrate thereby generating the bubbles in the solution.

47 . A system for processing a substrate comprising:

a rotary support for supporting a substrate;

a transducer assembly comprising a transmitter and a transducer adapted to generate sonic energy, the transducer acoustically coupled to the transmitter;

the transducer assembly positioned so that so that a portion of the vibration transmitter is adjacent to and spaced from a surface of a substrate on the rotary support so that when a liquid is applied to the surface of the substrate, a film of the liquid couples the portion of the transmitter to the surface of the substrate;

a plurality of holes in an outer surface of the transmitter, the holes extending into the transmitter as internal passageways that are adapted to be operably connected to a source of a solution comprising bubbles having a predetermined size.

Assignments (15)
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 21744/FRAME 0209 AND REEL 21731/FRAME 0608 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: WAFER HOLDINGS, INC.
Reel/Frame 045097/0070 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 021731/FRAME 0718 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: WAFER HOLDINGS, INC.
Reel/Frame 045103/0624 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2018
From: AKRION SYSTEMS LLC
To: NAURA AKRION INC.
Reel/Frame 045097/0140 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 23220/FRAME 0423 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0189 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 22973/FRAME 0811 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0288 →
SECURITY AGREEMENT Recorded Sep 14, 2009
From: AKRION SYSTEMS LLC
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 023220/0423 →
SECURITY AGREEMENT Recorded Jul 20, 2009
From: AKRION SYSTEMS, LLC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 022973/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2009
From: WAFER HOLDINGS, INC.; AKRION TECHNOLOGIES, INC.
To: AKRION SYSTEMS LLC
Reel/Frame 022824/0970 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 021731/0718 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021731/0608 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021744/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2008
From: PNC BANK, NATIONAL ASSOCIATION; BHC INTERIM FUNDING II, L.P.; AKRION, INC.; GOLDFINGER TECHNOLOGIES, LLC; AKRION TECHNOLOGIES, INC.; SCP SERVICES, INC. (F/K/A AKRION SCP ACQUISITION CORP.)
To: WAFER HOLDINGS, INC.
Reel/Frame 021658/0928 →
SECURITY AGREEMENT Recorded Sep 1, 2008
From: AKRION TECHNOLOGIES, INC.
To: SUNRISE CAPITAL PARTNERS, L.P.
Reel/Frame 021462/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2007
From: AKRION, INC.
To: AKRION TECHNOLOGIES, INC.
Reel/Frame 019756/0567 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2007
From: FRANKLIN, COLE
To: AKRION, INC.
Reel/Frame 019742/0855 →