Patent Assignment
Reel/Frame 057393/0609
Assignment of Assignor's Interest
Recorded: 2021-09-01
Pages: 7
Assignor
FORMFACTOR BEAVERTON, INC.
Executed: 2021-08-26
Assignee
FORMFACTOR, INC.
7005 SOUTHFRONT ROAD, LIVERMORE, CALIFORNIA, 94551
Covered Properties
(83)
Membrane Probing System
Probe Station
Substrate-Holding Device for Testing Circuit Arrangements on Substrates
Guarded Tub Enclosure
Probe Station with Low Noise Characteristics
Patent:
6,847,219 →
Application:
10/666,219 →
Probe Station with Low Inductance Path
Test Apparatus with Loading Device
Probe Testing Structure
Probe for Testing a Device Under Test
Method and Prober for Contacting a Contact Area with a Contact Tip
Apparatus for Testing Substrates
Thermal Optical Chuck
Probe Head Having a Membrane Suspended Probe
Probe Station Comprising a Bellows with Emi Shielding Capabilities
Interface for Testing Semiconductors
System for Testing Semiconductors
Probe for High Frequency Signals
Probe Holder for a Probe for Testing Semiconductor Components
Method for Measurement of a Device Under Test
Line-Reflect-Reflect Match Calibration
Probe for Testing a Device Under Test
Probe Support with Shield for the Examination of Test Substrates Under Use of Probe Supports
Probe Station for Testing Semiconductor Substrates and Comprising Emi Shielding
Probe Station and Method for Measurements of Semiconductor Devices Under Defined Atmosphere
Shielded Probe for Testing a Device Under Test
Chuck with Triaxial Construction
Prober for Testing Magnetically Sensitive Components
Probing Apparatus with Impedance Optimized Interface
Interface for Testing Semiconductors
Method and Arrangement for Positioning a Probe Card
Prober for Testing Devices in a Repeat Structure on a Substrate
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Test Apparatus for Measuring a Chracteristic of a Device Under Test
Replaceable Coupon for a Probing Apparatus
Method for Increasing the Accuracy of the Positioning of a First Object Relative to a Second Object
System for Testing Semiconductors
Method for Testing a Test Substrate Under Defined Thermal Conditions and Thermally Conditionable Prober
Probe Station for on-Wafer-Measurement Under Emi-Shielding
Arrangement and Method for Focusing a Multiplane Image Acquisition on a Prober
A Low Noise Connector with Cables Having a Center, Middle and Outer Conductors
Prober for Testing Devices in a Repeat Structure on a Substrate
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Method for Testing Electronic Components of a Repetitive Pattern Under Defined Thermal Conditions
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Systems and Methods for Simultaneous Optical Testing of a Plurality of Devices Under Test
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Method for Measurement of a Power Device
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
High Frequency Interconnect Structures, Electronic Assemblies That Utilize High Frequency Interconnect Structures, and Methods of Operating the Same
Optically Enhanced Digital Imaging System
Focusing Optical Systems and Methods for Testing Semiconductors
Method and Device for Contacting a Row of Contact Areas with Probe Tips
High Voltage Chuck for a Probe Station
Modular Prober and Method for Operating Same
Method of Replacing an Existing Contact of a Wafer Probing Assembly
Method for Testing a Test Substrate Under Defined Thermal Conditions and Thermally Conditionable Prober
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Systems and Methods for Handling Substrates at Below Dew Point Temperatures
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Prober for Testing Devices in a Repeat Structure on a Substrate
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Wafer-Handling End Effectors with Wafer-Contacting Surfaces and Sealing Structures
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
Shielded Probe Systems
Probes with Fiducial Marks, Probe Systems Including the Same, and Associated Methods
High Voltage Chuck for a Probe Station
Test Standards and Methods for Impedance Calibration of a Probe System, and Probe Systems That Include the Test Standards or Utilize the Methods
Shielded Probe Systems with Controlled Testing Environments
Systems and Methods for Electrically Testing Electromigration in an Electromigration Test Structure
Probe Head Assemblies and Probe Systems for Testing Integrated Circuit Devices
Method of Electrically Contacting a Bond Pad of a Device Under Test with a Probe
Probe Systems and Methods for Automatically Maintaining Alignment Between a Probe and a Device Under Test During a Temperature Change
Probe Systems, Storage Media, and Methods for Wafer-Level Testing Over Extended Temperature Ranges
High Voltage Chuck for a Probe Station
Probe Systems and Methods
Shielded Probe Systems with Controlled Testing Environments
Contact Engines, Probe Head Assemblies, Probe Systems, and Associated Methods for on-Wafer Testing of the Wireless Operation of a Device Under Test
Probe Systems and Methods Including Electric Contact Detection
Probe Systems for Testing a Device Under Test
Probes with Fiducial Targets, Probe Systems Including the Same, and Associated Methods
Probe Systems and Methods That Utilize a Flow-Regulating Structure for Improved Collection of an Optical Image of a Device Under Test
Probe Systems and Methods for Calibrating Capacitive Height Sensing Measurements
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest in United States Patents and Trademarks
Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Change of Name
Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
Merger
Apr 7, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 055859/0687 →
Security Interest
Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
Release of Security Interest
Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →