IP Library › Assignment 055859/0687
Patent Assignment
Reel/Frame 055859/0687

Merger

Recorded: 2021-04-07 Pages: 14
Assignor
FORMFACTOR BEAVERTON, INC.
Executed: 2021-02-02
Assignee
FORMFACTOR, INC.
7005 SOUTHFRONT ROAD, LIVERMORE, CALIFORNIA, 94551
Covered Properties (98)
Probe Station with Low Noise Characteristics
Guarded Tub Enclosure
Probe Station with Improved Interconnection
System for Testing Semiconductors
High Voltage Chuck for a Probe Station
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Wafer-Handling End Effectors
Probes with Fiducial Marks, Probe Systems Including the Same, and Associated Methods
Shielded Probe Systems
Probe Systems, Storage Media, and Methods for Wafer-Level Testing Over Extended Temperature Ranges
Probe Systems and Methods
Contact Engines, Probe Head Assemblies, Probe Systems, and Associated Methods for on-Wafer Testing of the Wireless Operation of a Device Under Test
Probe Systems and Methods Including Electric Contact Detection
Probe Systems for Testing a Device Under Test
Probes with Fiducial Targets, Probe Systems Including the Same, and Associated Methods
Probe Systems and Methods for Collecting an Optical Image of a Device Under Test
Probe Systems and Methods for Calibrating Capacitive Height Sensing Measurements
Microscopes with Objective Assembly Crash Detection and Methods of Utilizing the Same
Calibration Chucks for Optical Probe Systems, Optical Probe Systems Including the Calibration Chucks, and Methods of Utilizing the Optical Probe Systems
Methods for Maintaining Gap Spacing Between an Optical Probe of a Probe System and an Optical Device of a Device Under Test, and Probe Systems That Perform the Methods
Probe Systems for Optically Probing a Device Under Test and Methods of Operating the Probe Systems
Probe Systems and Methods for Characterizing Optical Coupling Between an Optical Probe of a Probe System and a Calibration Structure
Probe Systems and Methods for Testing a Device Under Test
Probe Systems Including Imaging Devices with Objective Lens Isolators, and Related Methods
Customizable Probe Cards, Probe Systems Including the Same, and Related Methods
Double-Sided Probe Systems with Thermal Control Systems and Related Methods
Probe for Testing a Device Under Test
Patent: 6,815,963 →
Application: 10/445,099 →
Publication: US 2004/0004491
System for Replacement of Sheet Abrasive
Patent: 7,223,160 →
Application: 10/552,391 →
Publication: US 2006/0189266
Optically enhanced digital imaging system
Application: 11/263,592 →
Publication: US 2006/0092505
Interface for Testing Semiconductors
Patent: 7,535,247 →
Application: 11/335,037 →
Publication: US 2006/0170441
Shielded Probe for High-Frequency Testing of a Device Under Test
Patent: 7,304,488 →
Application: 11/607,398 →
Publication: US 2007/0075716
Shielded Probe for Testing a Device Under Test
Patent: 7,518,387 →
Application: 11/906,055 →
Publication: US 2008/0024149
Shielded Probe with Low Contact Resistance for Testing a Device Under Test
Patent: 7,436,194 →
Application: 11/977,324 →
Publication: US 2008/0048692
Methods of Controlling the Operation of Probe Stations and Probe Stations That Perform the Methods, the Methods Including Generating and Executing a Test Routine That Directs the Probe Station to Electrically Test a Test Subset of a Plurality of Duts and to Pre-Test a Pre-Test Subset of a Plurality of Duts, Which Is a Subset of the Test Subset, with a Pre-Test
Application: 16/421,173 →
Publication: US 2019/0369141
Probe Systems and Methods Including Electric Contact Detection
Application: 16/421,243 →
Publication: US 2019/0277885
Probe Systems and Methods
Application: 16/600,142 →
Publication: US 2020/0041544
Microscopes with Objective Assembly Crash Detection and Methods of Utilizing the Same
Application: 16/752,324 →
Publication: US 2020/0241278
Calibration Chucks for Optical Probe Systems, Optical Probe Systems Including the Calibration Chucks, and Methods of Utilizing the Optical Probe Systems
Application: 16/884,921 →
Publication: US 2020/0378888
Methods for Maintaining Gap Spacing Between an Optical Probe of a Probe System and an Optical Device of a Device Under Test, and Probe Systems That Perform the Methods
Application: 16/914,913 →
Publication: US 2021/0096175
Probe Systems for Optically Probing a Device Under Test and Methods of Operating the Probe Systems
Application: 17/021,288 →
Publication: US 2021/0096176
Probe Systems and Methods for Characterizing Optical Coupling Between an Optical Probe of a Probe System and a Calibration Structure
Application: 17/028,102 →
Publication: US 2021/0096206
Probe Systems and Methods for Testing a Device Under Test
Application: 17/076,279 →
Publication: US 2021/0132145
Probe Systems Including Imaging Devices with Objective Lens Isolators, and Related Methods
Application: 17/078,778 →
Publication: US 2021/0132115
Customizable Probe Cards, Probe Systems Including the Same, and Related Methods
Application: 17/090,715 →
Publication: US 2021/0172978
Double-Sided Probe Systems with Thermal Control Systems and Related Methods
Application: 17/111,283 →
Publication: US 2021/0190860
Probe station
Application: 60/230,552 →
Wafer probe
Application: 60/251,186 →
Membrane tipped probe
Application: 60/383,017 →
Probe station with low noise characteristics
Application: 60/424,986 →
Probe station with low inductance path
Application: 60/429,082 →
Probe testing substructure
Application: 60/513,663 →
Thermal optical chuck
Application: 60/577,752 →
Probe head having a membrane suspended probe
Application: 60/586,299 →
Digital optical probe system
Application: 60/624,326 →
Microscope system for testing semiconductors
Application: 60/648,747 →
Microscope system for testing semiconductors
Application: 60/648,952 →
High frequency probe
Application: 60/688,821 →
Wideband hybrid active-passive differential signal probe
Application: 60/690,109 →
Wideband hybrid active-passive differential signal probe
Application: 60/739,397 →
Line-Reflect-Reflect Match calibration
Application: 60/831,940 →
Line-reflect-reflect match calibration
Application: 60/851,254 →
Replaceable coupon for a probing apparatus
Application: 61/199,910 →
Test system for flicker noise
Application: 61/200,187 →
Probe Station with Improved Interconnection
Application: 61/306,878 →
System for Testing Semiconductors
Application: 61/313,607 →
High Voltage Chuck for a Probe Station
Application: 61/352,061 →
High Voltage Chuck for a Probe Station
Application: 61/377,423 →
Optical Testing System
Application: 61/394,914 →
Membrane Based Probing Apparatus
Application: 61/484,116 →
High Frequency Interconnection
Application: 61/493,314 →
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Application: 61/723,401 →
Systems and Methods for Handling Wafers at Below Dew Point Temperatures
Application: 61/747,686 →
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Application: 61/747,703 →
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Application: 61/876,680 →
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Application: 61/944,461 →
Wafer-Handling End Effectors
Application: 61/949,096 →
Probe Systems and Methods for Automatically Maintaining Alignment Between a Probe and a Device Under Test During a Temperature Change
Application: 62/259,814 →
Methods for Wafer-Level Testing Over Extended Temperature Ranges
Application: 62/317,168 →
Probe Systems and Methods
Application: 62/400,978 →
Contact Engines, Probe Head Assemblies, and Probe Systems for on-Wafer Testing of the Wireless Operation of a Device Under Test
Application: 62/428,297 →
Probe Systems and Methods Including Electric Contact Detection
Application: 62/481,245 →
Probe Systems for Testing a Device Under Test
Application: 62/566,641 →
Probe Stations for Testing a Device Under Test and Associated Methods
Application: 62/680,929 →
Probe Systems and Methods for Collecting an Optical Image of a Device Under Test
Application: 62/701,135 →
Probe Systems and Methods for Calibrating Capacitive Height Sensing Measurements
Application: 62/789,625 →
Microscopes with Objective Assembly Crash Detection and Methods of Utilizing the Same
Application: 62/798,300 →
Calibration Chucks for Optical Probe Systems, Optical Probe Systems Including the Calibration Chucks, and Methods of Utilizing the Optical Probe Systems
Application: 62/856,413 →
Methods for Maintaining Gap Spacing Between an Optical Probe of a Probe System and an Optical Device of a Device Under Test and Probe Systems That Perform the Methods
Application: 62/908,403 →
Probe Systems for Optically Probing a Device Under Test and Methods of Operating the Probe Systems
Application: 62/908,423 →
Methods of Characterizing Optical Coupling Between an Optical Probe of a Probe System and a Calibration Structure and Probe Systems That Perform the Methods
Application: 62/908,440 →
Probe Systems and Methods for Testing a Device Under Test
Application: 62/930,959 →
Probe Systems with Electrical Grounding Assemblies
Application: 62/931,581 →
Methods of Characterizing Optical Coupling Between an Optical Probe of a Probe System and an Optical Structure and Probe Systems That Perform the Methods
Application: 62/939,399 →
Customizable Probe Cards, Probe Systems Including the Same, and Related Methods
Application: 62/945,718 →
Double-Sided Probe Systems with Thermally Controlled Probe Heads
Application: 62/949,921 →
Methods of Producing Augmented Probe System Images and Associated Probe Systems
Application: 63/032,310 →
Probe Systems Configured to Test a Device Under Test and Methods of Operating the Probe Systems
Application: 63/142,203 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 5, 2012
From: ANDREWS, PETER; HESS, DAVID
To: CASCADE MICROTECH, INC.
Reel/Frame 028899/0689 →
Assignment of Assignor's Interest Dec 3, 2012
From: SIMMONS, MICHAEL E.; NEGISHI, KAZUKI; JENSEN, ROY; GARRISON, RYAN
To: CASCADE MICROTECH, INC.
Reel/Frame 029395/0212 →
Security Agreement Dec 5, 2013
From: TIMESAVERS, LLC
To: MB FINANCIAL BANK, N.A.
Reel/Frame 031766/0018 →
Assignment of Assignor's Interest Nov 5, 2014
From: FEHRMANN, FRANK; HIRSCHFELD, BOTHO; KANEV, STOJAN
To: CASCADE MICROTECH, INC.
Reel/Frame 034111/0617 →
Assignment of Assignor's Interest Feb 20, 2015
From: NEGISHI, KAZUKI; HILL, ERIC
To: CASCADE MICROTECH, INC.
Reel/Frame 034999/0512 →
Assignment of Assignor's Interest Feb 26, 2015
From: INGRAM-GOBLE, ROBBIE; SIMMONS, MICHAEL E.; WOLF, PHILIP; GARRISON, RYAN
To: CASCADE MICROTECH, INC.
Reel/Frame 035039/0669 →
Security Interest in United States Patents and Trademarks Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Assignment of Assignor's Interest Feb 7, 2017
From: SIMMONS, MICHAEL E.; BOLT, BRYAN CONRAD; STORM, CHRISTOPHER ANTHONY; NEGISHI, KAZUKI
To: CASCADE MICROTECH, INC.
Reel/Frame 041191/0512 →
Assignment of Assignor's Interest Feb 7, 2017
From: BOLT, BRYAN CONRAD; FRANKEL, JOSEPH GEORGE
To: CASCADE MICROTECH, INC.
Reel/Frame 041191/0087 →
Assignment of Assignor's Interest Mar 29, 2017
From: MCMULLEN, TIMOTHY ALLEN; SHEPLER, JEFFERY ALLAN; VANDER GIESSEN, CLINT
To: CASCADE MICROTECH, INC.
Reel/Frame 041786/0992 →
Assignment of Assignor's Interest Sep 20, 2017
From: FISHER, GAVIN NEIL; THAERIGEN, THOMAS REINER, DR.; MCCANN, PETER; JONES, RODNEY
To: CASCADE MICROTECH, INC.
Reel/Frame 043637/0070 →
Assignment of Assignor's Interest Nov 27, 2017
From: BOCK, DANIEL MARK; CLEARY, TIM
To: CASCADE MICROTECH, INC.
Reel/Frame 044228/0478 →
Assignment of Assignor's Interest Mar 26, 2018
From: CHOON BENG, SIA; NEGISHI, KAZUKI
To: CASCADE MICROTECH, INC.
Reel/Frame 045351/0148 →
Change of Name Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
Assignment of Assignor's Interest Sep 28, 2018
From: STORM, CHRISTOPHER; SIMMONS, MICHAEL E.; BOLT, BRYAN CONRAD; FISHER, GAVIN NEIL
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 047005/0269 →
Assignment of Assignor's Interest Jan 17, 2019
From: FRANKEL, JOSEPH GEORGE; DUCKWORTH, KOBY L.; NEGISHI, KAZUKI
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 048048/0337 →
Change of Name Mar 13, 2019
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 049949/0542 →
Assignment of Assignor's Interest May 23, 2019
From: BENG, SIA CHOON; HESS, DAVID RANDLE; LEONG, CHUNYI YIN
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 049272/0640 →
Assignment of Assignor's Interest Jun 21, 2019
From: TEICH, MICHAEL; BECKER, AXEL
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 049548/0705 →
Assignment of Assignor's Interest Dec 31, 2019
From: NEGISHI, KAZUKI; FRANKEL, JOSEPH GEORGE; CHRISTENSON, ERIC ROBERT
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 051393/0602 →
Assignment of Assignor's Interest Jan 27, 2020
From: GISLER, GERALD LEE; BENG, SIA CHOON; LORD, ANTHONY JAMES; FISHER, GAVIN NEIL
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 051635/0400 →
Assignment of Assignor's Interest May 28, 2020
From: NEGISHI, KAZUKI; SIMMONS, MICHAEL E.; STORM, CHRISTOPHER ANTHONY; FRANKEL, JOSEPH GEORGE
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 052779/0692 →
Assignment of Assignor's Interest Jun 30, 2020
From: FRANKEL, JOSEPH GEORGE
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 053092/0659 →
Assignment of Assignor's Interest Sep 18, 2020
From: FRANKEL, JOSEPH GEORGE; NEGISHI, KAZUKI; SIMMONS, MICHAEL E.; CHRISTENSON, ERIC ROBERT
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 053816/0636 →
Assignment of Assignor's Interest Sep 23, 2020
From: FRANKEL, JOSEPH GEORGE; NEGISHI, KAZUKI
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 053857/0369 →