Patent Assignment
Reel/Frame 046573/0664
Change of Name
Recorded: 2018-07-18
Pages: 6
Assignor
CASCADE MICROTECH, INC.
Executed: 2018-05-14
Assignee
FORMFACTOR BEAVERTON, INC.
9100 SW GEMINI DRIVE, BEAVERTON, OREGON, 97008
Covered Properties
(132)
Probes with Fiducial Marks, Probe Systems Including the Same, and Associated Methods
PCT:
PCT/US2016/068114 ↗
Shielded Probe Systems
PCT:
PCT/US2016/068121 ↗
Probe Systems and Methods Including Active Environmental Control
PCT:
PCT/US2016/068270 ↗
Shielded Probe Systems with Controlled Testing Environments
PCT:
PCT/US2017/024580 ↗
Probe Systems, Storage Media, and Methods for Wafer-Level Testing Over Extended Temperature Ranges
PCT:
PCT/US2017/024748 ↗
Space Transformers, Planarization Layers for Space Transformers, Methods of Fabricating Space Transformers, and Methods of Planarizing Space Transformers
PCT:
PCT/US2017/031730 ↗
Systems and Methods for Electrically Testing Electromigration in an Electromigration Test Structure
PCT:
PCT/US2017/034210 ↗
Probe Head Assemblies and Probe Systems for Testing Integrated Circuit Devices
PCT:
PCT/US2017/034485 ↗
Probe Systems and Methods
PCT:
PCT/US2017/052405 ↗
Contact Engines, Probe Head Assemblies, Probe Systems, and Associated Methods for on-Wafer Testing of the Wireless Operation of a Device Under Test
PCT:
PCT/US2017/063305 ↗
Probe Systems and Methods Including Electric Contact Detection
PCT:
PCT/US2018/024290 ↗
Membrane Probing System
Patent:
6,256,882 →
Application:
09/115,571 →
A Method for Conctructing a Membrane Probe Using a Depression
Patent:
6,578,264 →
Application:
09/546,927 →
Membrane Probing System
Membrane Probing System
Probe Station
Wafer Probe
Substrate-Holding Device for Testing Circuit Arrangements on Substrates
Probe Station Thermal Chuck with Shielding for Capacitive Current
Guarded Tub Enclosure
Method for Constructing a Membrane Probe Using a Depression
Probe Station with Low Noise Characteristics
Patent:
6,847,219 →
Application:
10/666,219 →
Probe Station with Low Inductance Path
Test Apparatus with Loading Device
Membrane Probing Method Using Improved Contact
Membrane Probing System
Probe Testing Structure
Probe for Testing a Device Under Test
Method and Prober for Contacting a Contact Area with a Contact Tip
Optical Testing Device
Apparatus for Testing Substrates
Active Wafer Probe
Guarded Tub Enclosure
Membrane Probing System
Probe Station
Localizing a Temperature of a Device for Testing
Thermal Optical Chuck
Probe Head Having a Membrane Suspended Probe
Probe Station Comprising a Bellows with Emi Shielding Capabilities
Device for Testing Thin Elements
Interface for Testing Semiconductors
System for Testing Semiconductors
Procedure for Reproduction of a Calibration Position of an Aligned and Afterwards Displaced Calibration Substrate in a Probe Station
Shielded probe for testing a device under test
Probe for High Frequency Signals
Wideband Active-Passive Differential Signal Probe
Adapter for Positioning of Contact Tips
Probe Station Thermal Chuck with Shielding for Capacitive Current
Probe Holder for a Probe for Testing Semiconductor Components
Probe Holder for a Probe for Testing Semiconductor Components
Probe for Combined Signals
On-Wafer Test Structures for Differential Signals
Method for Measurement of a Device Under Test
Guarded Tub Enclosure
Wafer Probe
Probe Station with Low Inductance Path
Method and Apparatus for Controlling the Temperature of Electronic Components
Line-Reflect-Reflect Match Calibration
Probe for Testing a Device Under Test
Probe Support with Shield for the Examination of Test Substrates Under Use of Probe Supports
Probe Station for Testing Semiconductor Substrates and Comprising Emi Shielding
Probe Station and Method for Measurements of Semiconductor Devices Under Defined Atmosphere
Probe Station Thermal Chuck with Shielding for Capacitive Current
Chuck for Holding a Device Under Test
Shielded Probe for Testing a Device Under Test
Shielded Probe for Testing a Device Under Test
Membrane Probing System
Chuck with Triaxial Construction
Probe Head Having a Membrane Suspended Probe
Prober for Testing Magnetically Sensitive Components
Double Sided Probing Structures
Probing Apparatus with Impedance Optimized Interface
Interface for Testing Semiconductors
Method and Arrangement for Positioning a Probe Card
Prober for Testing Devices in a Repeat Structure on a Substrate
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Test Apparatus for Measuring a Chracteristic of a Device Under Test
Replaceable Coupon for a Probing Apparatus
Method for Increasing the Accuracy of the Positioning of a First Object Relative to a Second Object
System for Testing Semiconductors
Method for Testing a Test Substrate Under Defined Thermal Conditions and Thermally Conditionable Prober
Probe Holder
Probe Station for on-Wafer-Measurement Under Emi-Shielding
Membrane Probing Method Using Improved Contact
Arrangement and Method for Focusing a Multiplane Image Acquisition on a Prober
A Low Noise Connector with Cables Having a Center, Middle and Outer Conductors
Prober for Testing Devices in a Repeat Structure on a Substrate
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Method for Testing Electronic Components of a Repetitive Pattern Under Defined Thermal Conditions
Chuck for Supporting and Retaining a Test Substrate and a Calibration Substrate
Systems and Methods for Simultaneous Optical Testing of a Plurality of Devices Under Test
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Method for Measurement of a Power Device
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
High Frequency Interconnect Structures, Electronic Assemblies That Utilize High Frequency Interconnect Structures, and Methods of Operating the Same
Optically Enhanced Digital Imaging System
Focusing Optical Systems and Methods for Testing Semiconductors
Method and Device for Contacting a Row of Contact Areas with Probe Tips
High Voltage Chuck for a Probe Station
Modular Prober and Method for Operating Same
Method of Replacing an Existing Contact of a Wafer Probing Assembly
Method for Testing a Test Substrate Under Defined Thermal Conditions and Thermally Conditionable Prober
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Systems and Methods for Handling Substrates at Below Dew Point Temperatures
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Method for Verifying a Test Substrate in a Prober Under Defined Thermal Conditions
Prober for Testing Devices in a Repeat Structure on a Substrate
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Wafer-Handling End Effectors with Wafer-Contacting Surfaces and Sealing Structures
Resilient Electrical Interposers, Systems That Include the Interposers, and Methods for Using and Forming the Same
Probe Head Assemblies, Components Thereof, Test Systems Including the Same, and Methods of Operating the Same
Shielded Probe Systems
Probes with Fiducial Marks, Probe Systems Including the Same, and Associated Methods
High Voltage Chuck for a Probe Station
Test Standards and Methods for Impedance Calibration of a Probe System, and Probe Systems That Include the Test Standards or Utilize the Methods
Shielded Probe Systems with Controlled Testing Environments
Space Transformers, Planarization Layers for Space Transformers, Methods of Fabricating Space Transformers, and Methods of Planarizing Space Transformers
Application:
15/152,177 →
Publication:
US 2017/0330677
Systems and Methods for Electrically Testing Electromigration in an Electromigration Test Structure
Probe Head Assemblies and Probe Systems for Testing Integrated Circuit Devices
Method of Electrically Contacting a Bond Pad of a Device Under Test with a Probe
Probe Systems and Methods for Automatically Maintaining Alignment Between a Probe and a Device Under Test During a Temperature Change
Probe Systems, Storage Media, and Methods for Wafer-Level Testing Over Extended Temperature Ranges
High Voltage Chuck for a Probe Station
Probe Systems and Methods
Shielded Probe Systems with Controlled Testing Environments
Contact Engines, Probe Head Assemblies, Probe Systems, and Associated Methods for on-Wafer Testing of the Wireless Operation of a Device Under Test
Probe Systems and Methods Including Electric Contact Detection
Probe Stations, Probe Systems Including the Probe Stations, and Methods for Controlling the Operation of Probe Stations
Application:
15/986,517 →
Publication:
US 2018/0341399
Probe Systems for Testing a Device Under Test
Application:
62/566,641 →
Probes with Fiducial Targets, Probe Systems Including the Same, and Associated Methods
Application:
62/619,282 →
Probe Stations for Testing a Device Under Test and Associated Methods
Application:
62/680,929 →
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest in United States Patents and Trademarks
Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Assignment of Assignor's Interest
Feb 7, 2017
From: SIMMONS, MICHAEL E.; BOLT, BRYAN CONRAD; STORM, CHRISTOPHER ANTHONY; NEGISHI, KAZUKI
To: CASCADE MICROTECH, INC.
Reel/Frame 041191/0512 →
Assignment of Assignor's Interest
Feb 7, 2017
From: BOLT, BRYAN CONRAD; FRANKEL, JOSEPH GEORGE
To: CASCADE MICROTECH, INC.
Reel/Frame 041191/0087 →
Assignment of Assignor's Interest
Feb 7, 2017
From: TEICH, MICHAEL; KIESEWETTER, JORG, DR.; HACKIUS, ULF; ZILL, FRANK
To: CASCADE MICROTECH, INC.
Reel/Frame 041191/0679 →
Assignment of Assignor's Interest
Mar 28, 2017
From: TEICH, MICHAEL; STOLL, KARSTEN; CLAUSS, WALTER MATTHIAS; SCHMIEDCHEN, SWEN
To: CASCADE MICROTECH, INC.
Reel/Frame 041770/0589 →
Assignment of Assignor's Interest
Mar 29, 2017
From: MCMULLEN, TIMOTHY ALLEN; SHEPLER, JEFFERY ALLAN; VANDER GIESSEN, CLINT
To: CASCADE MICROTECH, INC.
Reel/Frame 041786/0992 →
Assignment of Assignor's Interest
May 9, 2017
From: SWART, ROY E.; SALMON, JAY; LIEW, BRANDON
To: CASCADE MICROTECH, INC.
Reel/Frame 042307/0032 →
Assignment of Assignor's Interest
May 24, 2017
From: MCMULLEN, TIMOTHY ALLEN; HARRY, BRENT DALE; WILCOX, ERIC JAMES; DONLIN, JAMES J.
To: CASCADE MICROTECH, INC.
Reel/Frame 042493/0666 →
Assignment of Assignor's Interest
May 25, 2017
From: SALMON, JAY; SWART, ROY E.; LIEW, BRANDON
To: CASCADE MICROTECH, INC.
Reel/Frame 042509/0218 →
Assignment of Assignor's Interest
Sep 20, 2017
From: FISHER, GAVIN NEIL; THAERIGEN, THOMAS REINER, DR.; MCCANN, PETER; JONES, RODNEY
To: CASCADE MICROTECH, INC.
Reel/Frame 043637/0070 →
Assignment of Assignor's Interest
Nov 27, 2017
From: BOCK, DANIEL MARK; CLEARY, TIM
To: CASCADE MICROTECH, INC.
Reel/Frame 044228/0478 →
Assignment of Assignor's Interest
Mar 26, 2018
From: CHOON BENG, SIA; NEGISHI, KAZUKI
To: CASCADE MICROTECH, INC.
Reel/Frame 045351/0148 →
Change of Name
Mar 13, 2019
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 049949/0542 →
Merger
Apr 7, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 055859/0687 →
Assignment of Assignor's Interest
Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
Security Interest
Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
Release of Security Interest
Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →