IP Library Granted Patent US 7,292,057
Granted Patent B2
US 7,292,057 · App. 11/546,827 · Granted Nov 6, 2007

Probe station thermal chuck with shielding for capacitive current

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Quick Facts
Patent No.
US 7,292,057
App. No.
11/546,827
Granted
Nov 6, 2007
Kind
B2
Abstract

To reduce noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.

Claims (12)

1. A device for modifying a temperature of a surface of a probe station chuck, said device comprising:

(a) a first conductor conductively connected to a source of an electric current, said electric current producing an increase in a temperature of said first conductor, a difference between said temperature of said first conductor and said temperature of said surface of said probe station chuck modifying said temperature of said surface of said chuck; and

(b) a second conductor capacitively connected to said first conductor when current is flowing in said first conductor and conductively connected to a ground, said surface of said probe station chuck separated from a portion of said first conductor by a portion of said second conductor.

2. The device for modifying a temperature of a surface of a probe station chuck of claim 1 wherein a portion of said second conductor substantially encloses a portion of said first conductor.

3. The device for modifying a temperature of a surface of a probe station chuck of claim 1 wherein said source of electric current comprises a connection to a source ground potential and said connection of said second conductor to a ground comprises a conductive connection to said source ground potential.

4. The device for modifying a temperature of a surface of a probe station chuck of claim 1 further comprising a third conductor surrounding a major length of said first conductor and conductively connected to an enclosure substantially surrounding said surface of said probe station chuck.

5. A device for modifying a temperature of a surface of a probe station chuck, said device comprising:

(a) a first conductor conductively connected to a source of an electric current, said electric current producing one of an increase in a temperature of said first conductor and a decrease in said temperature of said first conductor, a difference between said temperature of said first conductor and said temperature of said surface of said probe station chuck modifying said temperature of said surface of said chuck; and

(b) a second conductor capacitively connected to said first conductor when current is flowing in said first conductor and conductively connected to a ground, said surface of said probe station chuck separated from a portion of said first conductor by a portion of said second conductor.

6. The device for modifying a temperature of a surface of a probe station chuck of claim 5 wherein a portion of said second conductor substantially encloses a portion of said first conductor.

7. The device for modifying a temperature of a surface of a probe station chuck of claim 5 wherein said source of electric current comprises a connection to a source ground potential and said connection of said second conductor to a ground comprises a conductive connection to said source ground potential said source of electric current.

8. The device for modifying a temperature of a surface of a probe station chuck of claim 5 further comprising a third conductor surrounding a major length of said first conductor and connected to an enclosure substantially surrounding said surface of said probe station chuck.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2006
From: COWAN, CLARENCE E.; TERVO, PAUL A.; DUNKLEE, JOHN L.
To: CASCADE MICROTECH, INC.
Reel/Frame 018415/0998 →