IP Library Granted Patent US 8,278,951
Granted Patent B2
US 8,278,951 · App. 11/940,355 · Granted Oct 2, 2012

Probe station for testing semiconductor substrates and comprising EMI shielding

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Quick Facts
Patent No.
US 8,278,951
App. No.
11/940,355
Granted
Oct 2, 2012
Kind
B2
Abstract

A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.

Claims (18)

1. Probe station for testing semiconductor substrates comprising:

a chuck for receiving a semiconductor substrate to be tested,

a probe holder plate on which probes for electrical contacting of the semiconductor substrate to be tested are disposed by a probe holder, the probes and probe holder comprising a probe arrangement,

at least one positioning system for positioning said semiconductor substrate with respect to the probes,

a housing enclosing at least the chuck and the probe arrangement and forming an electromagnetic shielding, said housing being subdivided by the probe holder plate into at least a probe housing and an other housing section, the probe housing completely enclosing the probe arrangement,

wherein the probe housing is adapted to be opened independently of the other housing section in such a manner that through an opening of the probe housing a part of the probe arrangement or the entire probe arrangement is optionally accessible and at least one section of a wall of the probe housing bounding the probe holder does not participate in the opening of the probe housing, and

a device for signal preparation, said device preprocessing and/or processing a signal from the probes, and being disposed within the housing.

2. Probe station for testing semiconductor substrates according to claim 1 , wherein the probe housing comprises a monitoring area with a monitoring opening for monitoring probe tips in contact with the semiconductor substrate, wherein the monitoring area comprises a section sunken from an enclosing wall of the housing in a direction of the probe tips, and at least a part of the housing wall enclosing the monitoring area forms, with the sunken section, a probe housing flap to be opened, whereby, on opening the flap, at least a part of the probe arrangement is accessible.

3. Probe station for testing semiconductor substrates according to claim 2 , wherein the sunken section of the housing wall is disposed parallel to the probe holder plate and at such a minimal distance from the plate that the probes between the probe holder plate and the sunken section of the housing wall extend without contacting one of the sunken section and the plate.

4. Probe station for testing semiconductor substrates according to claim 2 , wherein the monitoring area in an area of the probe tips comprises an opening which is covered by a cover plate which lies on the enclosing housing wall.

5. Probe station for testing semiconductor substrates according to claim 1 , wherein at least one housing section opposite to at least one other housing section comprises the shielding and also comprises an entire housing opposite to an external environment.

6. Probe station for testing semiconductor substrates according to claim 1 , wherein the device for signal preparation is disposed in a separate housing section enclosed on all sides and adapted to be opened, said separate housing section being separate from said probe housing and electromagnetically shielded with respect to the probe housing.

7. Probe station for testing semiconductor substrates according to claim 6 , wherein the separate housing section comprises a shielding different from the rest of the housing.

8. Probe station for testing semiconductor substrates according to claim 6 , wherein at least one housing section opposite to at least one other housing section comprises the shielding and also comprises an entire housing opposite to an external environment.

9. Probe station for testing semiconductor substrates according to claim 1 , wherein the housing realizes a shielding against low-frequency magnetic fields.

10. Probe station for testing semiconductor substrates according to claim 1 , wherein the housing is light-proof.

11. Probe station for testing semiconductor substrates according to claim 1 , wherein the probe holder comprises a probe-positioning unit.

12. Probe station for testing semiconductor substrates according to claim 1 , wherein the housing is subdivided into function sections closed with respect to one another and detachable from one another.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →