IP Library Granted Patent US 9,983,232
Granted Patent B2
US 9,983,232 · App. 14/491,606 · Granted May 29, 2018

Prober for testing devices in a repeat structure on a substrate

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Quick Facts
Patent No.
US 9,983,232
App. No.
14/491,606
Granted
May 29, 2018
Kind
B2
Abstract

A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Claims (12)

1. A prober for testing devices in a repeat structure on a substrate, the prober comprising:

a substrate carrier configured to retain the substrate;

a plurality of probe holders, wherein each of the plurality of probe holders is configured to retain a test probe of a plurality of test probes, and further wherein each of the plurality of probe holders includes a manipulator configured to move the test probe of the plurality of test probes responsive to a motion of an adjustment shaft; and

a probe holder plate, wherein each of the plurality of probe holders is operatively attached to the probe holder plate, wherein the probe holder plate is contained within a vacuum chamber, and further wherein the probe holder plate is configured to translate relative to the substrate without changing a relative orientation of the plurality of test probes with respect to one another.

2. The prober of claim 1 , wherein the adjustment shaft includes a displacement shaft and corresponding universal joint that extends to an outside of the vacuum chamber, wherein the displacement shaft and corresponding universal joint are configured to control the motion of the adjustment shaft, and further wherein the displacement shaft and corresponding universal joint are configured to provide for translation of the probe holder plate relative to the vacuum chamber without changing a relative orientation of the plurality of test probes with respect to one another.

3. The prober of claim 1 , wherein all of the plurality of test probes are configured to test a single device, and further wherein the probe holder plate is configured to translate from a first test position associated with testing of a first device to a second test position associated with testing of a second device without changing a relative orientation of the plurality of test probes with respect to one another.

4. The prober of claim 1 , wherein the substrate carrier is configured to be stationary within the vacuum chamber during the testing.

5. The prober of claim 1 , wherein the substrate includes a semiconductor wafer, and further wherein the devices include at least one of semiconductor chips and micromechanical devices.

6. The prober of claim 1 , wherein the vacuum chamber is configured to produce a vacuum, and further wherein the probe holder plate is configured to translate in a first direction that is parallel to a surface of the substrate carrier and in a second direction that is parallel to the surface of the substrate carrier and perpendicular to the first direction while the probe holder plate is within the vacuum.

7. The prober of claim 6 , wherein the probe holder plate is further configured to translate in a third direction that is perpendicular to the substrate carrier.

8. The prober of claim 1 , wherein the prober further includes a motor configured to control the motion of the adjustment shaft.

9. The prober of claim 1 , wherein the substrate is in thermal communication with a temperature control device configured to control a temperature of the substrate.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST Recorded Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
MERGER Recorded Sep 19, 2014
From: SUSS MICROTEC TEST SYSTEMS GMBH
To: CASCADE MICROTECH, INC.
Reel/Frame 033782/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2014
From: WERNER, FRANK-MICHAEL; ZIEGER, MATTHIAS; GIESSMANN, SEBASTIAN
To: SUSS MICROTEC TEST SYSTEMS GMBH
Reel/Frame 033781/0609 →