Probe station and method for measurements of semiconductor devices under defined atmosphere
View Patent ↗A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
1. A prober for testing of semiconductor substrates comprising:
a chuck, which has a mounting plate for mounting of a semiconductor substrate,
a probe holder to accommodate test tips which serve for electrical contacting of the semiconductor substrate for testing, and
a positioning device with which the mounting plate can be moved relative to the test tips in X-, Y- and Z-directions,
the semiconductor substrate and the test tips being arranged within a housing that is sealed relative to a surrounding atmosphere, the housing comprises two housing parts joined with a seal, and the seal is connected to a pressure generation device for inflation with a plurality of different pressures;
the seal comprising a first upwardly extending portion and a second portion of the seal adjacent said first portion, said first portion extending further toward at least one housing part of said housing parts than said second portion extends toward said at least one housing part at a first pressure of the plurality of different pressures;
said first portion and said second portion contacting said at least one housing part at a second pressure of the plurality of different pressures, said second pressure allowing movement of said two housing parts relative to each other; and
said first portion and said second portion contacting said at least one housing part at a third pressure of the plurality of different pressures, said first portion and said second portion being less deformable and allowing less movement of said two housing parts relative to each other at said third pressure relative to said second pressure, said second pressure being less than said third pressure.
2. Prober according to claim 1 , wherein the chuck is movable, at least in the X- and Y-directions, and a lower housing part encloses the mounting plate and the semiconductor substrate and is connected to the chuck, so that the lower housing part is moved with the chuck.
3. Prober according to claim 1 , wherein said first housing part includes the seal and second housing part has a flat sealing surface against which the seal is pressed in different positions of the sealing surface and seal relative to each other.
4. Prober according to claim 1 , wherein the mounting plate is temperature-controllable.
5. Prober according to claim 1 , wherein the housing is adapted to be connected to a vacuum source and has a gas feed for inlet of a gas.
6. Prober according to claim 1 , wherein the mounting plate and/or the test tips are adapted to be coarsely and finely positioned relative to each other.
7. Prober according to claim 1 , wherein the positioning device includes a first positioning device for positioning of the chuck and a second positioning device for positioning of the test tips.
8. Prober according to claim 1 , wherein the positioning device is adapted to be manipulated from outside of the housing.
9. Housing of a prober for testing of semiconductor substrates, which encloses a work area, in which testing occurs, and is sealed off relative to the surrounding atmosphere, comprising two housing parts, which are joined via a seal, and the seal is adapted to be inflated with a plurality of different pressures;
the seal comprising a first upwardly extending portion and a second portion of the seal adjacent said first portion, said first portion extending further toward at least one housing part of said housing parts than said second portion extends toward said at least one housing part at a first pressure of the plurality of different pressures;
said first portion and said second portion contacting said at least one housing part at a second pressure of the plurality of different pressures, said second pressure allowing movement of said two housing parts relative to each other; and
said first portion and said second portion contacting said at least one housing part at a third pressure of the plurality of different pressures, said first portion being less deformable and allowing less movement of said two housing parts relative to each other at said third pressure relative to said second pressure, said second pressure being less than said third pressure.
10. Method for testing of semiconductor substrates within a housing sealed relative to the surrounding atmosphere according to claim 9 , further comprising first coarsely and later finely positioning a semiconductor substrate arranged on a mounting surface of a chuck relative to test tips by a positioning device,
after the fine positioning, electrically contacting the substrate by the test tips,
wherein the coarse positioning occurs under atmospheric conditions at said first pressure, whereupon the housing is sealed at said second pressure relative to surrounding atmosphere by inflation of the seal and a defined atmosphere is produced within the housing, after which the fine positioning occurs, and the seal of the housing is inflated to said third pressure, so that sealing required for the test is produced and the semiconductor substrate is then contacted with the test tips and tested.
11. Method according to claim 10 , wherein in the semiconductor substrate, after production of the defined atmosphere and before fine positioning, is temperature-controlled.
12. Method according to claim 10 , wherein after inflation to the third pressure in the seal, a test atmosphere deviating from the defined atmosphere is produced in the housing.
13. The prober of claim 1 wherein said first portion extends further toward said at least one housing part than said second portion extends toward said at least one housing part at said first pressure.
14. The prober of claim 1 wherein said first portion and said second portion comprise two portions of a plurality of portions forming a W shape at said first pressure.
15. The prober of claim 1 wherein said second portion comprises a trough adjacent said first portion at said first pressure.
16. A prober for testing of semiconductor substrates comprising:
a chuck, which has a mounting plate for mounting of a semiconductor substrate,
a probe holder to accommodate test tips which serve for electrical contacting of the semiconductor substrate for testing, and
a positioning device with which the mounting plate can be moved relative to the test tips in X-, Y- and Z-directions,
the semiconductor substrate and the test tips being arranged within a housing that is sealed relative to a surrounding atmosphere, the housing comprises two housing parts joined with a seal, and the seal is connected to a pressure generation device for inflation with a plurality of different pressures;
the seal comprising a first upwardly extending contacting portion and a second portion of the seal adjacent said first portion, said first portion extends further toward at least one housing part of said housing parts than said second portion extends toward said at least one housing part at a first pressure of the plurality of different pressures;
the first portion and the second portion contacting said at least one housing part at a second pressure of the plurality of different pressures.
17. The prober of claim 16 wherein the first portion and the second portion contact said at least one housing part at a third pressure of the plurality of pressures such that the first portion is less deformable at said third pressure relative to said second pressure, said second pressure being less than said third pressure.
18. The prober of claim 16 wherein said first portion and said second portion allow movement of said two housing parts relative to each other at said second pressure.
19. The prober of claim 18 wherein said first portion and said second portion allow less movement of said two housing parts relative to each other at said third pressure relative to said second pressure.
20. The prober of claim 16 wherein said first portion and said second portion comprise two portions of a plurality of portions forming a W shape at said first pressure.
21. The prober of claim 16 wherein said second portion comprises a trough adjacent said first portion at said first pressure.