IP Library Granted Patent US 7,498,828
Granted Patent B2
US 7,498,828 · App. 11/820,518 · Granted Mar 3, 2009

Probe station with low inductance path

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Quick Facts
Patent No.
US 7,498,828
App. No.
11/820,518
Granted
Mar 3, 2009
Kind
B2
Abstract

A probe assembly suitable for high-current measurements of an electrical device.

Claims (12)

1. A probe assembly for probing an electrical device, said probe assembly comprising:

(a) a chuck having a first conductive member suitable for supporting an electrical device; and

(b) a second conductive member spaced apart from said chuck, wherein said electrical device is spaced between said first conductive member and said second conductive member, wherein said first conductive member is electrically interconnected to said second conductive member, wherein said first conductive member and said second conductive member are electrically connected to the same potential.

2. The probe assembly of claim 1 wherein said second conductive member is electrically interconnected to a test signal of said electrical device.

3. The probe assembly of claim 1 wherein said first conductive member comprises a first plate, said second conductive member comprises a second plate, and wherein said second conductive member is spaced further distant from said electrical device than said first conductive member.

4. The probe assembly of claim 1 wherein said second conductive member comprises a second plate and is vertically spaced apart from said first conductive member.

5. The probe assembly of claim 1 wherein said second conductive member is electrically interconnected to said first conductive member completely within an environmental chamber.

6. The probe assembly of claim 1 wherein said second conductive member is free from being supported by said chuck.

7. The probe assembly of claim 1 wherein said first conductive member is electrically interconnected to a first probe, wherein said second conductive member is electrically interconnected to a second probe.

8. The probe assembly of claim 1 wherein said first conductive member and said second conductive member are electrically interconnected to a first probe.

9. The probe assembly of claim 1 wherein said first probe is electrically interconnected to test instrumentation using a twisted pair of wires over at least 50% of the distance between said first probe and said test instrumentation.

10. The probe assembly of claim 1 further comprising a detachable substantially closed loop member engageable with said first conductive member and said second conductive member, where said loop member includes a flexible member interconnecting said first conductive member and said second conductive member.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2007
From: DUNKLEE, JOHN; COWAN, C. EUGENE
To: CASCADE MICROTECH, INC.
Reel/Frame 019632/0077 →