IP Library Granted Patent US 8,497,693
Granted Patent B2
US 8,497,693 · App. 12/681,806 · Granted Jul 30, 2013

Method for testing a test substrate under defined thermal conditions and thermally conditionable prober

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Quick Facts
Patent No.
US 8,497,693
App. No.
12/681,806
Granted
Jul 30, 2013
Kind
B2
Abstract

In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Claims (21)

1. Method for testing a test substrate under defined thermal conditions, wherein the test substrate to be tested is held by a temperature-controllable chuck and is set to a test temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes, comprising:

setting at least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate to a desired temperature that is independent of the test temperature of the test substrate by a temperature-controlling device, and

holding the temperature of the at least one component constant.

2. Method for testing a test substrate, as claimed in claim 1 , wherein the at least one component of the positioning device is set to an expected temperature, which the said at least one component would reach in a thermal equilibrium state of a prober; and the expected temperature is reached within a period of time, in which the test substrate is temperature-controlled to the test temperature.

3. Method for testing a test substrate, as claimed in claim 1 , wherein the at least one component of the positioning device is set to a temperature that deviates significantly from the test temperature of the test substrate.

4. Method for thermal conditioning of a prober, as claimed in claim 1 , wherein the test substrate is positioned by a chuck drive; and at least one component of the chuck drive is set to the desired temperature.

5. Method for thermal conditioning of a prober, as claimed in claim 1 , wherein the test probes are positioned by a manipulator; and that manipulator is set to the desired temperature.

6. Method for testing a test substrate, as claimed in claim 1 , wherein the testing is observed by means of a positionable viewing unit; and a drive of the viewing unit is set to a desired temperature that is independent of the temperature of the test substrate by a temperature controlling device; and the temperature of the drive is held constant.

7. Method for testing a test substrate, as claimed in claim 1 , wherein temperature control is effected by heat exchangers.

8. Method for testing a test substrate, as claimed in claim 1 , wherein temperature control is effected by a directed flow of a temperature-controlled gas.

9. Thermally conditionable prober comprising:

a temperature-controllable chuck for receiving and for temperature-controlling a test substrate,

test probes for making contact with the test substrate; and

a positioning device for positioning the test substrate relative to the test probes, further comprising a temperature controlling device that sets at least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate at a desired temperature that is held constant and that is independent of the temperature of the test substrate.

10. Thermally conditionable prober, as claimed in claim 9 , wherein the chuck has a chuck drive for positioning the test substrate, and at least one component of the chuck drive is set to the desired temperature by the temperature-controlling device.

11. Thermally conditionable prober, as claimed in claim 9 , wherein the prober comprises at least one manipulator for positioning the test probes, and the manipulator is set to the desired temperature by the temperature-controlling device.

12. Thermally conditionable prober, as claimed in claim 11 , wherein the manipulator is mounted on a probe holder plate and is set, indirectly by way of the probe holder plate, to the desired temperature by the temperature-controlling device.

13. Thermally conditionable prober, as claimed in claim 9 , wherein the temperature-controlling device comprises a heat exchanger.

14. Thermally conditionable prober, as claimed in claim 9 , wherein the temperature-controlling device comprises a flow device for generating a flow of a temperature-controlled gas on a component of the positioning device.

15. Thermally conditionable prober, as claimed in claim 9 , wherein the prober comprises a moveable viewing unit for viewing a test; and a temperature-controlling device that operates on a drive of the viewing unit in order to reach a defined temperature that is held constant and that is independent of the temperature of the test substrate.

16. Thermally conditionable prober, as claimed in claim 9 , wherein the prober further comprises a housing that shields against electromagnetic radiation and that at least partially surrounds the positioning device of the prober.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
MERGER Recorded May 9, 2011
From: SUSS MICROTEC TEST SYSTEMS GMBH
To: CASCADE MICROTECH, INC.
Reel/Frame 026246/0706 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2010
From: KIESEWETTER, JOERG; KANEV, STOJAN; TEICH, MICHAEL; STOLL, KARSTEN; SCHMIDT, AXEL
To: CASCADE MICROTECH DRESDEN GMBH
Reel/Frame 024773/0447 →