Wafer probe

1. A probe comprising:

(a) a substantially rigid support base;

(b) a substantially and uniformly flexible circuit board attached and inclined with respect to said support base, wherein said circuit board includes a resistor-capacitor network comprising a first set of capacitors connected between adjacent power and ground transmission lines, and a second set of capacitors are not adjacent said power and ground transmission lines connected respectively to said first set of capacitors;

(c) an integrated tip assembly comprising a plurality of contact fingers supported by and extending from said circuit board, wherein said contact fingers are interconnected with said circuit board and are arranged as a unity assembly, wherein said plurality of contact fingers are maintained in a predetermined alignment when attached to said support by a tab proximate the ends of said plurality of contact fingers.

2. The probe of claim 1 wherein a plurality of said contact fingers extend in a radially outward direction from said base.

3. The probe of claim 2 wherein the arrangement of said contact fingers match the geometry of e contacting pads on a device under test.

4. The probe of claim 1 wherein said unitary assembly includes a tab proximate the ends of said plurality of contact fingers that maintains said contact fingers in said predetermined alignment.

5. The probe of claim 4 wherein said tab is removed prior to probing with said contact fingers.

6. The probe of claim 1 wherein said circuit board includes a respective trace for each of said contact fingers.

7. The probe of claim 6 wherein said respective traces are electrically interconnected to a connector suitable to interconnect to test equipment.

8. The probe of claim 5 wherein said removal of said tab leaves the ends of each of said plurality of contact fingers in a predetermined position.

9. The probe of claim 1 wherein said plurality of contact fingers is greater than three.