IP Library Assignment 049949/0542
Patent Assignment
Reel/Frame 049949/0542

Change of Name

Recorded: 2019-03-13 Pages: 4
Assignor
CASCADE MICROTECH, INC.
Executed: 2018-05-14
Assignee
FORMFACTOR BEAVERTON, INC.
9100 SW GEMINI DRIVE, BEAVERTON, OREGON, 97008
Covered Properties (48)
Probe Station Thermal Chuck with Shielding for Capacitive Current
Patent: 6,445,202 →
Application: 09/345,571 →
A Method for Conctructing a Membrane Probe Using a Depression
Patent: 6,578,264 →
Application: 09/546,927 →
Probe Station Thermal Chuck with Shielding for Capacitive Current
Patent: 6,512,391 →
Application: 10/179,771 →
Publication: US 2002/0167329
Membrane Probing System
Patent: 7,355,420 →
Application: 10/223,863 →
Publication: US 2003/0090278
Method for Constructing a Membrane Probe Using a Depression
Patent: 7,178,236 →
Application: 10/418,510 →
Publication: US 2003/0192183
Shielded Probe for Testing a Device Under Test
Patent: 7,057,404 →
Application: 10/445,174 →
Publication: US 2005/0099191
Membrane Probing System
Patent: 6,930,498 →
Application: 10/909,229 →
Publication: US 2005/0007131
Membrane Probing System
Patent: 7,148,711 →
Application: 11/144,852 →
Publication: US 2005/0248359
Optically enhanced digital imaging system
Application: 11/263,592 →
Publication: US 2006/0092505
Membrane Probing System
Patent: 7,403,025 →
Application: 11/509,176 →
Publication: US 2006/0284630
Method of Constructing a Membrane Probe
Patent: 7,533,462 →
Application: 11/607,156 →
Publication: US 2007/0074392
Method of constructing a membrane probe using a depression
Application: 12/378,650 →
Publication: US 2009/0178277
Membrane Probing System
Application: 60/137,759 →
Membrane probing system
Application: 60/184,851 →
Wafer probe
Application: 60/251,186 →
Membrane probing system
Application: 60/314,155 →
Probe station with low noise characteristics
Application: 60/424,986 →
Probe station with low inductance path
Application: 60/429,082 →
Probe head having a membrane suspended probe
Application: 60/586,299 →
Digital optical probe system
Application: 60/624,326 →
Microscope system for testing semiconductors
Application: 60/648,747 →
Microscope system for testing semiconductors
Application: 60/648,952 →
Wideband hybrid active-passive differential signal probe
Application: 60/690,109 →
Wideband hybrid active-passive differential signal probe
Application: 60/739,397 →
On-wafer test structures
Application: 60/813,099 →
Line-Reflect-Reflect Match calibration
Application: 60/831,940 →
Line-reflect-reflect match calibration
Application: 60/851,254 →
Replaceable coupon for a probing apparatus
Application: 61/199,910 →
Test system for flicker noise
Application: 61/200,187 →
Probe Station with Improved Interconnection
Application: 61/306,878 →
System for Testing Semiconductors
Application: 61/313,607 →
High Voltage Chuck for a Probe Station
Application: 61/352,061 →
High Voltage Chuck for a Probe Station
Application: 61/377,423 →
Optical Testing System
Application: 61/394,914 →
Probing Apparatus with a Coupon
Application: 61/410,242 →
Membrane Based Probing Apparatus
Application: 61/484,116 →
High Frequency Interconnection
Application: 61/493,314 →
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Application: 61/723,401 →
Systems and Methods for Handling Wafers at Below Dew Point Temperatures
Application: 61/747,686 →
Systems and Methods for Providing Wafer Access in a Wafer Processing System
Application: 61/747,703 →
Systems and Methods for Testing Electronic Devices That Include Low Power Output Drivers
Application: 61/876,680 →
Systems and Methods for on-Wafer Dynamic Testing of Electronic Devices
Application: 61/944,461 →
Wafer-Handling End Effectors
Application: 61/949,096 →
Probe Systems and Methods for Automatically Maintaining Alignment Between a Probe and a Device Under Test During a Temperature Change
Application: 62/259,814 →
Methods for Wafer-Level Testing Over Extended Temperature Ranges
Application: 62/317,168 →
Contact Engines, Probe Head Assemblies, and Probe Systems for on-Wafer Testing of the Wireless Operation of a Device Under Test
Application: 62/428,297 →
Probe Systems and Methods Including Electric Contact Detection
Application: 62/481,245 →
Probe Stations, Probe Systems Including the Probe Stations, and Methods for Controlling the Operation of Probe Stations
Application: 62/510,127 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 16, 2012
From: NEGISHI, KAZUKI; SWE, TOENAING; RODGERS, JORDAN; SIMMONS, MICHAEL
To: CASCADE MICROTECH, INC.
Reel/Frame 028797/0252 →
Security Interest in United States Patents and Trademarks Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
Change of Name Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
Merger Apr 7, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 055859/0687 →
Release of Security Interest Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →