Granted Patent B2

US 9,110,131 · App. 13/640,432 · Granted Aug 18, 2015

Abstract

Claims (27)

1. A method for contacting a plurality of contact areas with a corresponding array of probe tips, wherein the plurality of contact areas is arranged in at least one row on a surface of a semiconductor substrate, wherein the plurality of contact areas and the array of probe tips are positioned relative to one another with a reciprocating device such that the plurality of contact areas and the array of probe tips are opposed to one another and separated by a separation distance in a vertical direction, the method comprising:

contacting the plurality of contact areas with corresponding probe tips of the array of probe tips by moving the plurality of contact areas and the array of probe tips toward one another with a vertical feeding motion of the reciprocating device; and

observing a contact zone between a probe tip of the array of probe tips and a corresponding contact area of the plurality of contact areas with an observation unit during the contacting, wherein the observing includes:

observing the contact zone from a first observation direction; and

observing the contact zone from a second observation direction that is different from the first observation direction, wherein the first observation direction and the second observation direction are defined in a plane of observation that is at least one of parallel to the surface of the semiconductor substrate and coplanar with the surface of the semiconductor substrate, and further wherein the first observation direction and the second observation direction define an observation angle that is between 0 and 180 degrees.

2. The method of claim 1 , wherein the observation angle is greater than 0 degrees and less than 90 degrees.

3. The method of claim 1 , wherein the observing from the first observation direction and the observing from the second observation direction are performed sequentially.

4. The method of claim 1 , wherein the observing from the first observation direction and the observing from the second observation direction are performed simultaneously.

5. The method of claim 1 , wherein the contact zone includes a plurality of probe tips, and further wherein the observing includes simultaneously observing the plurality of probe tips during the contacting.

6. The method of claim 1 , wherein the semiconductor substrate defines a recessed region, wherein the contact zone is located within the recessed region, and further wherein the observing includes observing at least one contact area of the plurality of contact areas that is located within the recessed region.

7. The method of claim 6 , wherein the recessed region is defined between two stacked components that are mounted on the substrate surface.

8. The method of claim 6 , wherein the recessed region is defined within a scribed groove that extends within the semiconductor substrate.

9. The method of claim 1 , wherein the observing includes observing a deformation of each probe tip of the array of probe tips during the contacting.

10. The method of claim 9 , wherein the contacting includes ceasing the moving responsive to determining that each probe tip of the array of probe tips has experienced a specified minimum degree of deformation.

11. The method of claim 9 , wherein the observing the contact zone includes detecting a faulty contact.

12. The method of claim 11 , wherein the method further includes adjusting an alignment of the semiconductor substrate relative to the array of probe tips responsive to the detecting.

13. The method of claim 1 , wherein the first observation direction is parallel to the at least one row.

14. The method of claim 1 , wherein the observing the contact zone includes observing a mirror image of the array of probe tips on the surface of the semiconductor substrate.

15. A system for contacting a plurality of contact areas that are arranged in at least one row on a surface of a semiconductor substrate, the system comprising:

a chuck that defines a receiving surface that is configured to receive the semiconductor substrate;

a probe mount that includes an array of probe tips;

a reciprocating device that is configured to position the chuck and the array of probe tips relative to one another to permit contact between the plurality of contact areas and corresponding probe tips of the array of probe tips; and

an observation unit that is configured to observe a contact zone between a probe tip of the array of probe tips and a corresponding contact area of the plurality of contact areas, wherein the observation unit is configured to permit the contact zone to be viewed, via the observation unit, from two different observation directions by pivoting while maintaining the two different observation directions within a plane of observation that is at least one of parallel to the surface of the semiconductor substrate and coplanar with the surface of the semiconductor substrate, wherein the two different observation directions define an observation angle that is between 0 and 180 degrees.

16. The system of claim 15 , wherein the observation unit further is configured to move in a plane that is perpendicular to the receiving surface.

17. The system of claim 16 , wherein the observation angle is between 0 degrees and 90 degrees.

18. The system of claim 15 , wherein the observation unit is a first observation unit, and further wherein the system includes a second observation unit.

19. The system of claim 18 , wherein the first observation unit is configured to observe the contact zone from a first observation direction, and further wherein the second observation unit is configured to observe the contact zone from a second observation direction that is different from the first observation direction.

Assignments (6)