IP Library Granted Patent US 6,847,219
Granted Patent B1
US 6,847,219 · App. 10/666,219 · Granted Jan 25, 2005

Probe station with low noise characteristics

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Quick Facts
Patent No.
US 6,847,219
App. No.
10/666,219
Granted
Jan 25, 2005
Kind
B1
Abstract

A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

Claims (39)

1. A probe station for probing a device under test comprising:

(a) a support for holding said device under test;

(b) a probing device for testing said device under test while being supported by said support;

(c) a cable connecting said probing device to a test instrument, said cable including:

(i) a first conductor, a first dielectric, and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(ii) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor;

(iii) further including a first layer of material between said second dielectric and said third conductor of suitable composition for reducing triboelectric current generation between said second dielectric and said third conductor to less than that which would occur were said second dielectric and said third conductor to directly adjoin each other.

2. The probe station of claim 1 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

3. A probe station for probing a device under test comprising:

(a) a support for holding said device under test;

(b) a probing device for testing said device under test while being supported by said support;

(c) a cable connecting said probing device to a test instrument, said cable including:

(i) a first conductor, a first dielectric, and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(ii) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor;

(iii) further including a first layer of material between said second dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said second dielectric and said second conductor to less than that which would occur were said second dielectric and said second conductor to directly adjoin each other.

4. The probe station of claim 3 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

5. A probe station for probing a device under test comprising:

(a) a support for holding said device under test;

(b) a probing device for testing said device under test while being supported by said support;

(c) a cable connecting said probing device to a test instrument, said cable including:

(i) a first conductor, a first dielectric, and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(ii) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor;

(iii) further including a first layer of material between said first dielectric and said first conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said first conductor to less than that which would occur were said first dielectric and said first conductor to directly adjoin each other.

6. The probe station of claim 5 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

7. A cable comprising

(a) a first conductor, a first dielectric, and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(b) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor;

(c) further including a first layer of material between said second dielectric and said third conductor of suitable composition for reducing triboelectric current generation between said second dielectric and said third conductor to less than that which would occur were said second dielectric and said third conductor to directly adjoin each other.

8. The cable of claim 7 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

9. A cable comprising:

(a) a first conductor, a first dielectric; and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(b) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor,

(c) further including a first layer of material between said second dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said second dielectric and said second conductor to less than that which would occur were said second dielectric and said second conductor to directly adjoin each other.

10. The cable of claim 9 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

11. A cable comprising:

(a) a first conductor, a first dielectric, and a second conductor, where said first dielectric is between said first conductor and said second conductor;

(b) a second dielectric, and a third conductor, where said second dielectric is between said second conductor and said third conductor;

(c) further including a first layer of material between said first dielectric and said first conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said first conductor to less than that which would occur were said first dielectric and said first conductor to directly adjoin each other.

12. The probe station of claim 11 further comprising a second layer of material between said first dielectric and said second conductor of suitable composition for reducing triboelectric current generation between said first dielectric and said second conductor to less than that which would occur were said first dielectric and said second conductor to directly adjoin each other.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST Recorded Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2021
From: FORMFACTOR BEAVERTON, INC.
To: FORMFACTOR, INC.
Reel/Frame 057393/0609 →
CHANGE OF NAME Recorded Jul 18, 2018
From: CASCADE MICROTECH, INC.
To: FORMFACTOR BEAVERTON, INC.
Reel/Frame 046573/0664 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2004
From: COWAN, CLARENCE E.
To: CASCADE MICROTECH, INC.
Reel/Frame 015162/0155 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2004
From: LESHER, TIMOTHY; MILLER, BRAD; SIMMONS, MIKE; GRAY, FRANK; MCDONALD, CYNTHIA L.
To: CASCADE MICROTECH, INC.
Reel/Frame 015060/0976 →