Probe on carrier architecture for vertical probe arrays
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener can be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
1. A probe array for testing electrical devices, the probe array comprising:
a space transformer;
two or more probe carrier plates disposed on or in proximity to the space transformer;
wherein each probe carrier plate has two or more vertical probes disposed on it;
wherein each vertical probe includes a first flexible member that makes electrical contact to the space transformer;
wherein each vertical probe includes a second flexible member configured to make temporary electrical contact to a device under test;
wherein each vertical probe includes a probe body affixed to a corresponding one of the two or more carrier plates;
wherein for each vertical probe, its probe body and its first flexible member and its second flexible member are monolithic parts of the corresponding vertical probe.
2. The probe array of claim 1 , further comprising a mechanical stiffener member affixed to the space transformer.
3. The probe array of claim 2 , wherein the probe carrier plates are disposed on the space transformer, and wherein the mechanical stiffener member is configured to constrain both thermal expansion of the space transformer and deviation of the space transformer from flatness.
4. The probe array of claim 2 , wherein the probe carrier plates are disposed on the mechanical stiffener member, and wherein the first flexible members of the vertical probes are configured to accommodate both thermal expansion of the space transformer and deviation of the space transformer from flatness.
5. The probe array of claim 1 , wherein the vertical probes are 2D MEMS probes.
6. The probe array of claim 1 , wherein the space transformer includes a ceramic substrate.
7. The probe array of claim 1 , wherein the space transformer includes a printed circuit board substrate.
8. The probe array of claim 1 , wherein a probe array formed by tips of the second flexible members of the vertical probes is flat to a tolerance of 25 microns or less.