Method and system for compensating thermally induced motion of probe cards
View Patent ↗The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
1. In combination:
a probe card for testing a die on a wafer;
a prober for receiving said probe card for said testing;
an optical element on said probe card for directing a light beam hitting said optical element;
a light beam emitter for hitting said optical element on said probe card; and,
a light beam receiver for receiving said light beam from said optical element to measure deflection of said probe card.
2. The combination of claim 1 wherein said optical element comprises a lens.
3. The combination of claim 1 wherein said optical element comprises a minor.
4. The combination of claim 3 and further comprising a pair of minors having facing cylindrical surfaces in said prober and through which said light beam is deflected.
5. The combination of claim 3 and further comprising computer processor means for computing a first position and a second deflected position of said probe card from input to said light beam receiver.
6. The combination of claim 1 , wherein the prober comprises a housing to which the probe card can be attached.
7. In combination:
a probe card for testing a die on a wafer;
a prober for receiving said probe card for testing;
a light beam emitter on said probe card for producing a light beam; and
a light beam receiver for receiving said light beam from said light beam emitter to measure deflection of said probe card.
8. The combination of claim 7 and further comprising a pair of mirrors having facing cylindrical surfaces in said prober and through which said light beam is deflected.
9. The combination of claim 7 and further comprising a computer processor means for computing a first position and a second deflected position of said probe card from input to said light beam receiver.
10. A method of controlling the distance between a probe card and a wafer being tested in a prober, comprising:
providing a probe card for testing a plurality of die on a wafer;
providing a prober for receiving said probe card for testing;
providing a wafer on a chuck in said prober wherein said wafer is positioned for contact with said probe card;
providing a sensing system for measuring the distance between said probe card and said wafer; and,
adjusting said distance in response to changes in the distance reported by said sensing system.
11. The method of claim 10 wherein said measuring and adjusting are done repeatedly.
12. The method of claim 10 , further comprising bringing probes of the probe card and the wafer into contact one with another, wherein the sensing and adjusting are performed after the bringing the probes of the probe card into contact one with another.
13. The method of claim 12 , wherein the adjusting comprises moving the wafer.
14. The method of claim 13 , wherein the moving the wafer reduces the changes in the distance reported by the sensing system.
15. The method of claim 10 further comprising testing dies of the wafer, wherein the sensing and adjusting are performed during the testing.
16. The method of claim 15 , wherein the changes in the distance are caused by thermal expansion or contraction of the probe card during the testing.
17. A method for controlling the distance between a probe card and a wafer in a prober, comprising:
providing a probe card for testing a plurality of die on a wafer;
providing a prober for receiving said probe card for testing;
providing a wafer on a chuck in said prober;
measuring a first distance between said probe card and said wafer;
comparing via microprocessor means said first distance to a second distance to determine a variance therebetween; and,
when said microprocessor determines said variance exceeds a determined value, adjusting the distance between said probe card and said wafer.
18. The method of claim 17 wherein said comparing and adjusting is done repetitively until said variance does not exceed a determined value.
19. The method of claim 17 , further comprising bringing probes of the probe card and the wafer into contact one with another, wherein the measuring, comparing, and adjusting are performed after the bringing the probes of the probe card into contact one with another.
20. The method of claim 17 , wherein the adjusting comprises moving the chuck.
21. The method of claim 20 , wherein the moving the wafer reduces the variance in determined by the microprocessor means.
22. The method of claim 17 further comprising testing dies of the wafer, wherein the measuring, comparing, and adjusting are performed during the testing.
23. In combination:
a probe card for testing a plurality of die on a wafer;
a prober for receiving said probe card for testing;
an radiative source for transmitting a signal reporting information proportional to the position of the probe card during testing of the dies; and,
an radiative receiver for receiving said information.
24. The combination of claim 23 wherein said radiative source is attached to said probe card.
25. The combination of claim 23 Wherein said radiative source comprises a laser.
26. The combination of claim 23 , wherein the information is proportional to a position of the probe card relative to the dies.
27. The combination of claim 26 further comprising a processor configured to determine whether the position of the probe card relative to the dies changes during testing of the probes.
28. The combination of claim 27 , wherein the processor is further configured to control changing the position of the dies if the position of the probe card relative to the dies exceeds a predetermined tolerance during testing of the probes.