Probe head with inductance reducing structure
View Patent ↗Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
1. An electrical apparatus comprising:
a first guide plate including a first electrically conductive ground trace disposed on a first electrically insulating substrate;
a second guide plate including a second electrically conductive ground trace disposed on a second electrically insulating substrate;
two or more probes disposed to pass through corresponding holes in the first and second guide plates;
wherein the two or more probes include one or more signal probes that are electrically insulated from both the first and second electrically conductive ground traces, wherein the signal probes are configured to make temporary electrical contact between signal terminals of an electrical test apparatus and signal terminals of a device under test;
wherein the two or more probes include one or more ground probes that are electrically connected to both the first and second electrically conductive ground traces, wherein the ground probes are configured to make temporary electrical contact between ground terminals of the electrical test apparatus and ground terminals of the device under test; and
at least one ground pin electrically connected to both the first and second electrically conductive ground traces, wherein the ground pins do not mechanically make contact to the ground terminals of the electrical test apparatus, and wherein the ground pins do not mechanically make contact to the ground terminals of the device under test.
2. The apparatus of claim 1 , wherein a configuration of the ground pins, signal probes and ground probes is selected to improve a source impedance match of the signal probes and ground probes to an impedance of the electrical test apparatus.
3. The apparatus of claim 2 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.
4. The apparatus of claim 2 , wherein the configuration of the ground pins, signal probes and ground probes is also selected to improve a load impedance match of the signal probes and ground probes to an impedance of the device under test.
5. The apparatus of claim 4 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.
6. The apparatus of claim 1 , wherein a configuration of the ground pins, signal probes and ground probes is selected to improve a load impedance match of the signal probes and ground probes to an impedance of the device under test.
7. The apparatus of claim 6 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.
8. An electrical apparatus comprising:
a first electrically conductive guide plate;
a second electrically conductive guide plate;
two or more probes disposed to pass through corresponding holes in the first and second guide plates;
wherein the two or more probes include one or more signal probes that are electrically insulated from both the first and second electrically conductive guide plates, wherein the signal probes are configured to make temporary electrical contact between signal terminals of an electrical test apparatus and signal terminals of a device under test;
wherein the two or more probes include one or more ground probes that are electrically connected to both the first and second electrically conductive guide plates, wherein the ground probes are configured to make temporary electrical contact between ground terminals of the electrical test apparatus and ground terminals of the device under test; and
at least one ground pin electrically connected to both the first and second electrically conductive guide plates, wherein the ground pins do not mechanically make contact to the ground terminals of the electrical test apparatus, and wherein the ground pins do not mechanically make contact to the ground terminals of the device under test.
9. The apparatus of claim 8 , wherein a configuration of the ground pins, signal probes and ground probes is selected to improve a source impedance match of the signal probes and ground probes to an impedance of the electrical test apparatus.
10. The apparatus of claim 9 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.
11. The apparatus of claim 9 , wherein the configuration of the ground pins, signal probes and ground probes is also selected to improve a load impedance match of the signal probes and ground probes to an impedance of the device under test.
12. The apparatus of claim 11 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.
13. The apparatus of claim 8 , wherein a configuration of the ground pins, signal probes and ground probes is selected to improve a load impedance match of the signal probes and ground probes to an impedance of the device under test.
14. The apparatus of claim 13 , wherein the configuration of the ground pins is a pattern of one or more ground pins disposed at predetermined positions relative to a corresponding signal probe.