Method to build a wirebond probe card in a many at a time fashion
View Patent ↗Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.
1. An apparatus comprising
spring contact elements configured to make pressure contacts with an electronic component, a base portion of each spring contact element attached by an adhesive material directly to a surface of a support substrate, a contact portion of each spring contact element spaced away from the surface in a direction that is perpendicular to the surface of the substrate,
wherein the adhesive material comprises epoxy, and
wherein the adhesive material is non-conductive, and electrically isolates the spring contact elements from the support substrate.
2. The apparatus of claim 1 , wherein substantially only the epoxy attaches the spring contact elements to the support substrate.
3. An apparatus comprising:
spring contact elements attached by an adhesive material to a support substrate;
an additional substrate having bond pads, the support substrate being attached to the additional substrate;
traces provided on the support substrate;
first wire bonds connecting the spring contact elements to first ends of the traces; and
second wire bonds connecting the traces to the bond pads,
wherein at least one of the traces includes a thin film resistor.
4. An apparatus comprising:
spring contact elements attached by an adhesive material to a support substrate,
an additional substrate having bond pads, the support substrate being attached to the additional substrate;
traces provided on the support substrate;
first wire bonds connecting the spring contact elements to first ends of the traces; and
second wire bonds connecting the traces to the bond pads,
wherein at least one of the traces includes a capacitor.