Transferring electronic probe assemblies to space transformers

1. A method comprising:

forming a plurality of probes at a probe pitch, wherein each of said probes comprises a probe tip configured to contact an article under test, in an interior of a single sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,

wherein all interfaces between said sacrificial material and said sacrificial substrate are planar,

wherein said probe tips are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;

removing said sacrificial substrate;

subsequent to said removing said sacrificial substrate, attaching said sacrificial material comprising said plurality of probes to a through via substrate probe carrier having contacts at said probe pitch on both faces

subsequent to said removing said sacrificial substrate, attaching said through via substrate probe carrier to a space transformer,

wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at said probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes; and

removing said sacrificial material, while leaving said plurality of probes intact.

2. The method of claim 1 wherein said probe pitch is less than about 50 μm.

3. The method of claim 1 wherein said second pitch is at least twice said probe pitch.

4. The method of claim 1 wherein said plurality of probes comprise a nickel-manganese (NiMn) alloy.

5. The method of claim 1 wherein said sacrificial material comprises copper (Cu).

6. The method of claim 1 wherein said removing said sacrificial substrate and said removing said sacrificial material occur at about the same time.

7. A method comprising:

providing a sacrificial substrate, then:

forming a plurality of probes in an interior of a primary sacrificial material while disposed on said sacrificial substrate via microelectromechanical systems (MEMS) processes,

wherein tips of said plurality of probes are configured to contact an article under test and are formed away from said sacrificial substrate and the remaining structure of said plurality of probes extends towards said sacrificial substrate;

removing said primary sacrificial material from said plurality of probes and said sacrificial substrate;

subsequent to said removing, encapsulating said plurality of probes in a secondary sacrificial material;

bonding said encapsulated plurality of probes to a space transformer; and

removing said secondary sacrificial material.

8. The method of claim 7 wherein said plurality of probes are at a pitch of less than or equal to about 50 μm.

9. The method of claim 7 wherein said space transformer comprises first contacts at said probe pitch on one face, and corresponding second contacts on another face at least twice said probe pitch, and wherein corresponding first and second contacts are electrically coupled.

10. The method of claim 7 wherein said plurality of probes comprise a nickel-manganese (NiMn) alloy.

11. The method of claim 7 wherein said primary sacrificial material comprises copper (Cu).

12. The method of claim 7 wherein said removing said secondary sacrificial material takes place subsequent to said bonding.