IP Library Granted Patent US 7,253,651
Granted Patent B2
US 7,253,651 · App. 10/905,199 · Granted Aug 7, 2007

Remote test facility with wireless interface to local test facilities

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Quick Facts
Patent No.
US 7,253,651
App. No.
10/905,199
Granted
Aug 7, 2007
Kind
B2
Abstract

A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

Claims (44)

1. A method for controlling testing of electronic devices, said method comprising:

wirelessly transmitting test data to a local test facility, said test data for testing ones of said devices;

receiving the test data at the local test facility, a test controller at said local test facility configured to utilize said test data to test a plurality of said devices at said local test facility;

wirelessly receiving results of testing said ones of said devices; and

wirelessly transmitting test information regarding said results of said testing to at least one of a design facility where said devices are designed or a manufacturing facility where said devices are manufactured, only upon activation of a trigger.

2. The method of claim 1 , wherein said trigger relates to cumulative results of testing said electronic devices.

3. The method of claim 1 , wherein said trigger comprises completion of testing of a specified number of devices.

4. The method of claim 1 , wherein said trigger comprises failure of a specified number of devices.

5. The method of claim 1 further comprising setting said trigger from said design facility or said manufacturing facility.

6. The method of claim 1 further comprising wirelessly transmitting from said design facility or said manufacturing facility information for setting said trigger.

7. The method of claim 1 , wherein said test controller is separate and distinct from said devices.

8. The method of claim 1 further comprising wirelessly transmitting from said local test facility a request to test a plurality of devices introduced into said local test facility.

9. The method of claim 8 , wherein said request comprises information identifying a type of said devices.

10. The method of claim 8 , wherein said request comprises information identifying a time to start testing of said devices.

11. The method of claim 1 wherein said design facility or said manufacturing facility to which said test information is transmitted is located remotely from said local test facility.

12. The method of claim 1 , wherein said wirelessly transmitting test data, said wirelessly receiving results of testing, and said wirelessly transmitting test information are performed at a central test facility located remotely from said local test facility.

13. The method of claim 1 , wherein said test information is transmitted in real time.

14. The method of claim 1 , wherein said electronic devices comprise semiconductor dies.

15. The method of claim 14 , wherein said dies compose an unsingulated semiconductor wafer.

16. The method of claim 1 further comprising creating a design of said electronic devices at said design facility.

17. The method of claim 16 further comprising utilizing said test information to modify said design of said electronic devices.

18. The method of claim 16 further comprising manufacturing said electronic devices at said manufacturing facility.

19. The method of claim 18 further comprising utilizing said test information to modify manufacture of said electronic devices.

20. The method of claim 1 further comprising manufacturing said electronic devices at said manufacturing facility.

21. The method of claim 20 further comprising utilizing said test information to modify manufacture of said electronic devices.

22. An apparatus for controlling testing of electronic devices, said apparatus comprising:

first transmitting means for wirelessly transmitting test data to a local test facility, said test data for testing ones of said devices;

a test controller at said local test facility configured to utilize said test data to test a plurality of said devices at said local test facility;

receiving means for wirelessly receiving results of said testing of said ones of said devices; and

second transmitting means for wirelessly transmitting test information regarding said results of said testing to at least one of a design facility where said devices are designed or a manufacturing facility where said devices are manufactured, only upon activation of a trigger.

23. The apparatus of claim 14 , wherein said second transmitting means transmits said test information to one of said design facility or said manufacturing facility in real time.

24. The apparatus of claim 14 , wherein said electronic devices comprise semiconductor dies.

25. The apparatus of claim 24 , wherein said dies compose an unsingulated semiconductor wafer.

26. The apparatus of claim 22 , wherein said trigger relates to cumulative results of testing said electronic devices.

27. The apparatus of claim 22 , wherein said trigger comprises completion of testing a specified number of devices.

28. The apparatus of claim 22 , wherein said trigger comprises failure of a specified number of devices.

29. The apparatus of claim 22 further comprising means for setting at said design facility or said manufacturing facility said trigger.

30. The apparatus of claim 22 further comprising means for wirelessly transmitting from said design facility or said manufacturing facility information for setting said trigger.

31. The apparatus of claim 22 , wherein said test controller is separate and distinct from said devices.

32. The apparatus of claim 22 further comprising means for wirelessly transmitting from said local test facility a request to test a plurality of devices introduced into said local test facility.

33. The apparatus of claim 32 , wherein said request comprises information identifying a type of said devices.

34. The apparatus of claim 32 , wherein said request comprises information identifying a time to start testing said devices.

35. The apparatus of claim 22 wherein said design facility or said manufacturing facility to which said test information is transmitted is located remotely from said local test facility.

36. The apparatus of claim 22 , wherein said first transmitting means, said receiving means, and said second transmitting means are located in a central test facility located remotely from said local test facility.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST Recorded Jul 29, 2025
From: FORMFACTOR, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 072263/0272 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2005
From: KHANDROS, IGOR Y.; ELDRIDGE, BENJAMIN N.
To: FORMFACTOR, INC.
Reel/Frame 016864/0569 →