Alignment features in a probing device
View Patent ↗An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For example, such a feature may be a corner of one of the tips. An array of probes may be formed to have such alignment features.
1. A probing apparatus comprising:
a substrate; and
a plurality of probes disposed on said substrate, each of said probes comprising a contact tip, said tips disposed in a pattern to contact terminals of semiconductor dies to be tested,
wherein two or more of first probes of said plurality of probes each comprise a first tip disposed on a first substantially flat surface of said first probe, said first tip disposed on said first substantially flat surface such that a corner of said first tip is disposed at least a predetermined distance from a perimeter of said first substantially flat surface, wherein said predetermined distance is a minimum spacing for a processing algorithm to find said corner of said first tip in a digital image that includes portions of at least some of said probes, and
one or more of second probes of said plurality of probes each comprising a second tip disposed on a second substantially flat surface of said second probe, said second tip disposed on said second substantially flat surface such that all corners of said second tip are disposed less than said predetermined distance from a perimeter of said second substantially flat surface.
2. The probing apparatus of claim 1 , wherein said first tip of each of said first probes is disposed on said first substantially flat surface of said first probe such that a plurality of corners of said first tip are each disposed at least said predetermined distance from said perimeter of said first substantially flat surface.
3. The probing apparatus of claim 2 , wherein said predetermined distance is 10 microns.
4. The probing apparatus of claim 2 , wherein said first tip of each of said first probes is disposed on said first substantially flat surface of said first probe such that four of said corners of said first tip are each disposed at least said predetermined distance from said perimeter of said first substantially flat surface.
5. The probing apparatus of claim 1 , wherein:
each of said first probes comprises a first body coupled at a first end of said first body to said substrate, said first body extending away from said substrate to a second end of said first body, said first substantially flat surface comprising a first side of a first support structure, a second opposite side of said first support structure coupled to said second end of said first body; and
each of said second probes comprises a second body coupled at a first end of said second body to said substrate, said second body extending away from said substrate to a second end of said second body, said second substantially flat surface comprising a first side of a second support structure, a second opposite side of said second support structure coupled to said second end of said second body.
6. The probing apparatus of claim 5 , wherein said predetermined distance is 10 microns.
7. The probing apparatus of claim 1 , wherein said corner of said first tip comprises converging edges of said tip, and at least ⅓ of a length of each of said converging edges from said corner is disposed said predetermined distance from said perimeter of said first substantially flat surface.
8. The probing apparatus of claim 7 , wherein said predetermined distance is 10 microns.
9. The probing apparatus of claim 1 , wherein said probing apparatus is a probe card assembly for use in a test system for testing dies of a semiconductor wafer.
10. The probing apparatus of claim 9 , wherein said predetermined distance is 10 microns.
11. The probing apparatus of claim 1 , wherein said predetermined distance is 10 microns.