Probe card thermal conditioning system

1. A probe card thermal conditioning system for thermally conditioning a probe card prior to installation in a prober, comprising:

a housing;

an enclosure disposed within the housing, the enclosure sized and configured to hold a probe card inside the enclosure; and

a heat transfer element disposed inside the enclosure for thermally conditioning the probe card prior to installation of the probe card in a prober in which a device under test (DUT) is to be tested.

2. The system of claim 1 , wherein the enclosure is insulated.

3. The system of claim 1 , wherein the heat transfer element further comprises:

a heater.

4. The system of claim 1 , wherein the heat transfer element further comprises:

a cooling element.

5. The system of claim 1 , further comprising:

a controller for controlling the operation of the heat transfer element.

6. The system of claim 5 , further comprising:

a temperature monitor for monitoring the probe card temperature coupled to the controller.

7. The system of claim 1 , further comprising:

a plurality of enclosures disposed in the housing, each enclosure configured to house a probe card and having a heat transfer element disposed proximate a bottom of the respective enclosure for independently conditioning the plurality of probe cards.

8. The system of claim 1 , wherein the housing is part of a cart.

9. The system of claim 8 , wherein the cart has anti-static wheels.

10. The system of claim 1 , wherein the enclosure is at least partially removable from the housing.

11. The system of claim 1 , wherein the enclosure is removable from the housing and further comprises a container for shipping and/or storing a probe card.

12. The system of claim 11 , wherein the heat transfer element is part of the container.

13. The system of claim 1 , further comprising:

a controller configured to provide and/or control at least one of power on/off of the system or individual enclosures, a temperature of the enclosure, a safety interlock, a probe card temperature feedback loop, or an indicia of the temperature or of the relation of the temperature of either of the enclosure or the probe card to a predetermined set point.

14. The system of claim 1 , wherein the enclosure further comprises:

a recess; and

a ledge disposed about the recess and configured to support an edge of the probe card such that probes disposed on a bottom surface of the probe card extend into the recess towards the heat transfer element.

15. The system of claim 14 , further comprising:

a spacer configured to sit on the ledge for controlling a distance of the probes from the heat transfer element.

16. The system of claim 14 , further comprising:

a plurality of locating features disposed on the ledge for positioning the probe card with respect to the recess.

17. The system of claim 1 , further comprising:

a fan configured to circulate air within the enclosure.

18. The system of claim 17 , further comprising:

a purge gas source coupled to the enclosure, wherein the purge gas comprises dry purge gas.

19. The system of claim 18 , wherein the purge gas comprises at least one of dry air or nitrogen (N.sub.2).

20. The system of claim 1 , further comprising:

at least one shelf disposed in the housing.

21. The system of claim 1 , wherein the housing and the enclosure are part of a shipping container for transporting a probe card.

22. The system of claim 21 , wherein the shipping container further comprises:

a controller for controlling the operation of the heat transfer element;

a temperature monitor for monitoring the probe card temperature coupled to the controller; and

a display for indicating a state of the thermal conditioning system.

23. The system of claim 22 , further comprising:

a fan configured to circulate air within the enclosure.

24. A method of thermally conditioning a probe card prior to installation in a prober, comprising:

inserting a probe card in an enclosure disposed within a housing and having a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober;

bringing the probe card to a desired temperature while in the enclosure;

removing the probe card from the enclosure after reaching the desired temperature; and

inserting the probe card within a prober to test a device.

25. The method of claim 24 , wherein bringing the probe card to the desired temperature comprises:

heating the probe card.

26. A method of thermally conditioning a probe card prior to installation in a prober, comprising:

inserting a probe card in an enclosure disposed within a housing and having a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober; and

bringing the probe card to a desired temperature while in the enclosure,

wherein bringing the probe card to the desired temperature comprises:

cooling the probe card.

27. The method of claim 26 , further comprising:

circulating air or a dry gas within the enclosure to limit condensate formation on probes of the probe card.

28. A method of thermally conditioning a probe card prior to installation in a prober, comprising:

inserting a probe card into an enclosure at a first location, wherein the enclosure is disposed within a housing and having a heat transfer element disposed proximate a bottom of the enclosure for thermally conditioning the probe card prior to installation in a prober;

shipping the probe card within the enclosure to a second location; and

bringing the probe card to a desired temperature while in the enclosure at the second location.