Semiconductor Fuse Covering
A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to individual fuses on a semiconductor device subsequent to testing the semiconductor device is disclosed. A method and system for sealing exposed fuses on a semiconductor device is disclosed which allows the sealing step to be performed either prior to or following singulation of the semiconductor device into individual dice.
1 - 27 . (canceled)
28 . A semiconductor die comprising:
a fuse configured to allow a selective change to be made to the semiconductor die; and
a coating covering the fuse, the coating comprising at least a portion of a droplet of a substance.
29 . The semiconductor die of claim 28 further comprising a plurality of fuses each configured to allow a selective change to be made to the semiconductor die, and a plurality of coatings covering ones of the fuses, each coating comprising at least a portion of a droplet of the substance.
30 . The semiconductor die of claim 28 , wherein the droplet is a size in accordance with a print head.
31 . The semiconductor die of claim 28 , wherein a size of the droplet is approximately a size of the fuse.
32 . The semiconductor die of claim 28 , wherein the substance comprises dried ink.
33 . The semiconductor die of claim 28 , wherein:
the semiconductor die comprises on a same surface a fuse region and a non-fuse region, the non-fuse region being substantially larger in area than the fuse region; and
the fuse is disposed in the fuse region; and
the coating is substantially absent from the non-fuse region.
34 . The semiconductor die of claim 28 , wherein the fuse is a reverse fuse and the substance is electrically conductive.
35 . A semiconductor die made by a method comprising:
providing a semiconductor die having an exposed fuse in a fuse region, the fuse allowing a selective change to be made to the semiconductor die;
processing the semiconductor die while the fuse is exposed; and
applying a substance in liquid form to cover the fuse in the fuse region.
36 . The semiconductor die of claim 35 , wherein the semiconductor die further comprises a plurality of exposed fuses each configured to allow a selective change to be made to the semiconductor die, and the applying comprises applying the substance in liquid form to cover ones of the fuses.
37 . The semiconductor die of claim 35 , wherein the substance comprises dried ink.
38 . The semiconductor die of claim 35 , wherein the applying comprises spraying the substance onto the fuse.
39 . The semiconductor die of claim 35 , wherein the applying comprises depositing a droplet of the substance onto the fuse.
40 . The semiconductor die of claim 39 , wherein the depositing comprises sizing the droplet to approximate a size of the fuse.
41 . The semiconductor die of claim 39 , wherein the applying comprises depositing a plurality of droplets of the substance onto the fuse.
42 . The semiconductor die of claim 35 , wherein the processing the semiconductor die comprises packaging the semiconductor die, wherein the packaging leaves the fuse exposed.
43 . The semiconductor die of claim 35 , wherein:
the semiconductor die comprises on a same surface as the fuse region a non-fuse region, the non-fuse region being substantially larger in area than the fuse region; and
the substance is substantially absent from the non-fuse region.
44 . A semiconductor die comprising:
a fuse configured to allow a selective change to be made to the semiconductor die; and
a coating covering the fuse, the coating comprising a congealed liquid substance.
45 . The semiconductor die of claim 44 further comprising a plurality of fuses each of configured to allow a selective change to be made to the semiconductor die, wherein the coating covers ones of the fuses.