Contactor having a global spring structure and methods of making and using the contactor

1. A probing apparatus comprising:

a substrate;

a spring structure comprising a platform moveably attached to the substrate; and

a plurality of resilient probes attached to a surface of the platform, each said probe comprising a beam portion that extends away from the platform in a direction that is generally parallel to the surface the platform, the probe further comprising a contact portion disposed on the beam portion to contact a device, the beam portion being bendable with respect to the platform,

wherein:

the platform moves in a same, uniform movement in response to forces on the contact portions of the probes, the movement of the platform providing a uniform first source of compliance equally to each of the probes in response to the forces on the contact portions of the probes, and

each beam portion of each of the probes bends individually with respect to the platform in response to one of the forces on the contact portion of the probe, the bending of each of the beam portions providing second sources of individual compliance to each of the probes.

2. The probing apparatus of claim 1 , wherein:

the platform comprises extension arms movably connecting the platform to the substrate.

3. The probing apparatus of claim 1 , wherein:

the forces arise from contact between terminals of the device and the probes,

the first source of compliance comprises compliance in a first direction corresponding to a direction of the forces on the probes, and

the second sources of individual compliances each comprise compliance in a second direction, which corresponds to a scrubbing motion of the contact portions of the probes on the terminals of the device.

4. The probing apparatus of claim 3 , wherein each of the second sources of compliance further comprises compliance in the first direction.

5. The probing apparatus of claim 1 , wherein the substrate comprises a plurality of electrical contacts, and the probing apparatus further comprises a plurality of electrical connections electrically connecting ones of the electrical contacts with ones of the probes.

6. The probing apparatus of claim 1 , wherein:

the device comprises one or more semiconductor dies,

the probes are electrically conductive and disposed to contact terminals of the one or more dies,

the probing apparatus further comprises an electrical interface configured to receive test data for testing the one or more dies, and the probes are electrically connected to the interface.

7. The probing apparatus of claim 1 , wherein:

the substrate, spring structure, and probes compose a tile structure, and the probing apparatus comprises a plurality of such tile structures attached to a master substrate.

8. The probing apparatus of claim 1 further comprising a second spring structure attached to the substrate, and a second plurality of probes attached to the second spring structure.

9. The probing apparatus of claim 1 , wherein the platform of the spring structure to which the probes are attached comprises a torsional spring component, and each of the beam portions of the probes comprises a cantilever spring component.

10. The probing apparatus of claim 1 , wherein the movement of the platform of the spring structure to which the probes are attached provides the uniform first source of compliance equally to each of the probes in response to unequal forces on at least two of the contact portions of the probes.

11. The probing apparatus of claim 1 , wherein the beam portions of each of the probes are substantially parallel and oriented in a same direction.

12. A method of making a probing apparatus comprising:

obtaining a first substrate, a spring structure comprising a platform moveably attached to the first substrate, and a plurality of probes attached to a surface of the platform, wherein each of the probes comprises a beam portion extending away from the platform in a direction generally parallel to the surface of the platform;

configuring the spring structure such that the platform of the spring structure to which the probes are attached moves in a same, uniform movement in response to forces on contact portions of the probes, the movement of the platform of the spring structure providing a uniform first source of compliance equally to each of the probes in response to the forces; and

configuring the beam portions of each of the probes to bend individually with respect to the platform in response to one of the forces on the contact portion of the probe, the bending of each of the beam portions providing a second source of compliance individually to each probe in response to the forces.

13. The method of claim 12 , wherein the configuring the spring structure comprises forming the spring structure from one or more layers of a multilayer substrate, wherein the first substrate comprises one or more other layers of the multilayer substrate.

14. The method of claim 13 , wherein the forming the spring structure further comprises removing portions of the one or more layers of the multilayer substrate.

15. The method of claim 14 , wherein the removing comprising removing portions of the one or more layers to form extension arms attached to the first substrate and extending to the platform.

16. The method of claim 15 , wherein

the contact portion of each of the probes comprises a contact tip disposed on the beam portion of the probe.

17. The method of claim 12 further comprising:

forming a second spring structure from the one or more layers of the multilayer substrate; and

disposing a second plurality of resilient probes on the second spring structure.

18. The method of claim 12 further comprising:

providing a plurality of electrical contacts on the first substrate; and

electrically connecting ones of the electrical contacts with ones of the probes.

19. The method of claim 12 further comprising:

disposing the contact portions of the probes to contact terminals of one or more semiconductor dies to be tested,

providing an electrical interface configured to receive test data for testing the one or more dies, and

electrically connecting the probes to the interface.

20. The method of claim 12 , wherein the first substrate, spring structure and probes compose a tile structure, the method further comprising:

making a plurality of such tile structures; and

attaching the tile structures to a master substrate.

21. The method of claim 12 , wherein:

the forces on the contact portions of the probes arise from contact with terminals of an electronic device,

the first source of compliance comprises compliance in a first direction corresponding to a direction of the forces on the probes, and

the second sources of compliance each comprise compliance in a second direction, which corresponds to a scrubbing motion of the contact portions of the probes on the terminals of the electronic device.

22. The method of claim 21 , wherein each of the second sources of compliance further comprises compliance in the first direction.

23. The method of claim 12 , where:

the configuring the spring structure comprises configuring the platform to function as a torsional spring in response to the forces on the contact portions of the probes; and

the configuring the beam portions comprises configuring the beam portions to function as cantilever springs in response to the forces.

24. The method of claim 12 , wherein the movement of the platform of the spring structure to which the probes are attached provides the uniform first source of compliance equally to each of the probes in response to unequal forces on at least two of the contact portions of the probes.

25. The method of claim 12 , wherein the beam portions of each of the probes are substantially parallel and oriented in a same direction.