IP Library Granted Patent US 8,067,951
Granted Patent B2
US 8,067,951 · App. 12/498,862 · Granted Nov 29, 2011

Method of expanding tester drive and measurement capability

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Quick Facts
Patent No.
US 8,067,951
App. No.
12/498,862
Granted
Nov 29, 2011
Kind
B2
Abstract

A probe card assembly can comprise an interface, which can be configured to receive from a tester test signals for testing an electronic device. The probe card assembly can further comprise probes for contacting the electronic device and electronic driver circuits for driving the test signals to ones of the probes.

Claims (29)

1. A method of making DC measurements on an electronic device, the method comprising:

providing DC power from a power source to a first power input and a second power input of the electronic device;

driving a first test signal into a first signal input of the electronic device and holding the first test signal at the first signal input at a predefined voltage level, wherein the first signal input is different than the first power input and the second power input, and the first test signal is different than the DC power; and

while holding the first test signal at the first signal input at the predefined voltage level, measuring a difference between a first current through the first power input and a second current through the second power input.

2. The method of claim 1 , wherein the power source is disposed on a probe card assembly comprising a plurality of probes configured to contact terminals of the electronic device, and the step of providing power comprises providing power from the power source through ones of the probes to the electronic device.

3. The method of claim 2 , wherein at least one driver circuit is disposed on the probe card assembly and the step of driving a first test signal comprises the driver circuit driving the first test signal through at least one of the probes.

4. The method of claim 1 , wherein the electronic device comprises a plurality of semiconductor dies composing an unsingulated semiconductor wafer.

5. The method of claim 4 , wherein each of the semiconductor dies is a complementary metal oxide semiconductor die.

6. The method of claim 1 , further comprising putting signal inputs of the electronic device other than the first signal input into a high impedance state during the driving a first test signal.

7. The method of claim 1 , further comprising determining a leakage current of the electronic device from the difference between the first current and the second current.

8. The method of claim 1 further comprising:

removing the first test signal from the first signal input;

putting signal inputs, including the first signal input, of the electronic device other than a second signal input into a high impedance state;

driving a second test signal into the second signal input of the electronic device and holding the second test signal at the second signal input at a predefined voltage level; and

while holding the second test signal at the second signal input at the predefined voltage level, repeating the measuring a difference between a first current through the first power input and a second current through the second power input.

9. A method of making DC measurements on an electronic device, the method comprising:

providing power from a power source to the electronic device, wherein the power source is disposed on a probe card assembly comprising a plurality of probes configured to contact terminals of the electronic device, and the step of providing power comprises providing power from the power source through ones of the probes to the electronic device;

driving a test signal into an input of the electronic device; and

measuring current drawn by the electronic device from the power source, wherein the measuring current drawn by the electronic device comprises determining a difference between current flowing through a first power connection to the electronic device and current flowing through a second power connection from the electronic device.

10. A method of making DC measurements on an electronic device, the method comprising:

providing power from a power source to the electronic device;

driving a test signal into an input of the electronic device; and

measuring current drawn by the electronic device from the power source,

wherein the step of providing power comprises providing a first power input to the electronic device at a first voltage level and a second power input to the electronic device at a second voltage level, wherein the first voltage level is higher than the second voltage level.

11. The method of claim 10 , wherein the step of measuring current comprises measuring the current flowing through the second power input.

12. The method of claim 11 further comprising driving other inputs of the electronic device with signals having voltage levels between the first voltage level and the second voltage level.

13. The method of claim 11 further comprising putting other inputs of the electronic device into a high impedance state.

14. The method of claim 10 , wherein: the step of driving a test signal comprises driving the signal at a voltage level greater than the first voltage level, and the step of measuring current comprising measuring the current drawn through the first power input.

15. The method of claim 10 , wherein the step of measuring current comprises determining a difference between current flowing through the first power input and current flowing through the second power input.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →