Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
1. A composite wiring structure comprising:
a ceramic block structure comprising a plurality of first electrical contacts disposed on a first outer surface of the block structure, a plurality of second electrical contacts disposed in a first pattern on a second outer surface of the block structure, and a plurality of electrical paths through the block structure connecting ones of the first contacts and ones of the second contacts;
an insulating material deposited on ones of the second contacts;
a plurality of third electrical contacts disposed in a second pattern on the insulating material;
a plurality of electrical connections electrically connecting the third electrical contacts to the second electrical contacts, wherein the second pattern is different than the first pattern; and
a plurality of probes attached to ones of the third electrical contacts and disposed to contact semiconductor dies to be tested.
2. The composite wiring structure of claim 1 , wherein the electrical connections comprise electrically conductive vias through the insulating material to the second contacts, and electrically conductive traces disposed on the insulating material connecting ones of the vias with ones of the third contacts.
3. The composite wiring structure of claim 2 , wherein the insulating material comprises polyimid.
4. The composite wiring structure of claim 1 further comprises an electronic component electrically connected to ones of the third contacts.
5. The composite wiring structure of claim 4 , wherein the electronic component is one of a capacitor or a resistor.