Probe card cooling assembly with direct cooling of active electronic components

1. A probe card assembly comprising:

spring probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components, the die electrically connected to the package by a plurality of first compliant interconnects, wherein each of the first compliant interconnects is a structural element that is structurally distinct from each of the probe elements, and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the spring probe elements are disposed to correspond to terminals of electronic devices to be tested, and

wherein the spring probe elements have sufficient resiliency to form pressure based electrical connections with the terminals of the electronic devices to be tested while the spring probe elements and terminals are pressed against one another.

2. The probe card assembly of claim 1 , wherein the package further includes a bottom substrate, the first compliant interconnects being coupled between each die and the bottom substrate, wherein said first compliant interconnects comprise wirebond springs.

3. The probe card assembly of claim 1 , wherein the package further includes a bottom substrate, the first compliant interconnects being coupled between each die and the bottom substrate, wherein said first compliant interconnects comprise lithographic springs.

4. The probe card assembly of claim 1 , wherein the package further includes a top substrate and a bottom substrate and a third plurality of interconnection elements that provide electrical paths extending through a cavity between the top substrate and the bottom substrate.

5. The probe card assembly of claim 1 , wherein the package further includes at least one of an interposer and a printed circuit board such that said coolant further directly cools said at least one of an interposer and printed circuit board during a testing operation.

6. The probe card assembly of claim 1 , further comprising at least one non-contacting compliant interconnect coupled to a surface of said at least one die, whereby, heat can be further directed away form the surface of a die.

7. The probe card assembly 1 , wherein said package further comprises:

a top substrate; and

a bottom substrate; wherein each die is flip-chip bonded to said top substrate.

8. The probe card assembly of claim 1 , wherein:

the first compliant interconnects extend from the at least one die and terminate within an interior portion of the package, and

ends of the spring probe elements are attached to an exterior portion of the package, and

the spring probe elements extend from the ends away from the package.

9. The probe card assembly of claim 1 , wherein:

the first compliant interconnects are attached to and terminate at a first side of a substrate composing the package, and

each of the spring probe elements comprises a first end and a second end, and each of the spring probe elements is attached at the first end of the spring probe to a second side of the substrate and extends away from the second side of the substrate to the second end of the spring probe, and

the first side of the substrate is opposite the second side of the substrate.

10. The probe card assembly of claim 9 , wherein:

the first side of the substrate composes an interior portion of the package, and

the second side of the substrate composes an exterior portion of the package.

11. A probe card assembly comprising:

probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the package further includes a bottom substrate, a top substrate, first and second sets of compliant interconnects, and alignment posts, wherein the alignment posts are attached to the bottom substrate, the first set of compliant interconnects is coupled between each die and bottom substrate, and the second set of compliant interconnects is coupled between each die and the top substrate, and wherein the dies are held in place by frictional contact with the alignment posts, by direct contact between the first set of compliant interconnects and each die, and by downward pressure from the second sets of compliant interconnects on each die.

12. A probe card assembly comprising:

probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the package further includes a bottom substrate having output contacts arranged on an edge region of the bottom substrate, whereby external components can be electrically coupled to each die via the output contacts.

13. A probe card assembly comprising:

probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the package further includes a top substrate with a top surface representing an exterior surface of the package and wherein the top surface includes output contacts, whereby external components can be electrically coupled to the each die via the output contacts.

14. A probe card assembly comprising:

probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the package further includes a substrate, and alignment posts attached to the substrate, wherein the dies have electrical contacts aligned with the probe elements by the alignment posts.

15. The probe card assembly of claim 14 , wherein the dies are held in place by frictional contact with the alignment posts.

16. A probe card assembly comprising:

probe elements; and

a package coupled to the probe elements, wherein the package includes at least one die with active electronic components and at least one coolant port that allows a coolant to enter the package and directly cool the active electronic components of each die during a testing operation, wherein the probe elements are directly connected to the package,

wherein the package further includes a substrate with a surface representing an exterior surface of the package and wherein the surface includes output contacts, whereby external components can be electrically coupled to the each die via the output contacts.

17. A probe card cooling assembly for use in a test system comprising:

spring probe elements; and

a package comprising a chamber in which is disposed at least one die with active electronic components that are cooled by coolant within the chamber, the die being connected to an interior portion of the package by a plurality of compliant interconnects, the spring probe elements being connected to an exterior portion of the package, each of the compliant interconnects being a structural element that is structurally distinct from each of the spring probe elements,

wherein the spring probe elements are disposed to correspond to terminals of electronic devices to be tested, and

wherein the spring probe elements have sufficient resiliency to form pressure based electrical connections with the terminals of the electronic devices to be tested while the spring probe elements and terminals are pressed against one another.