Rotating contact element and methods of fabrication
View Patent ↗Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
1. A rotating contact element, comprising:
a tip having a first side configured to contact a terminal of a semiconductor device to be tested and an opposing second side; and
a plurality of deformed members lithographically formed in an initial shape upon and extending from the second side of the tip, the deformed members being permanently deformed into a deformed shape different than the initial shape, the deformed members being arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
2. The element of claim 1 , further comprising a base coupled to respective ends of the plurality of deformed members opposite the tip.
3. The element of claim 1 , wherein the tip further comprises one or more contacts extending from the first side thereof.
4. The element of claim 1 , wherein the tip further comprises one contact extending from a center of the first side thereof.
5. The element of claim 1 , wherein the tip further comprises a plurality of contacts extending from the first side thereof.
6. The element of claim 5 , wherein each one of the plurality of contacts is aligned with a respective one of the plurality of deformed members.
7. The element of claim 1 , wherein the tip and the plurality of deformed members are unitary.
8. The element of claim 1 , wherein the tip and deformed members comprise at least one of nickel, cobalt, copper, or beryllium.
9. A probe card assembly for testing a semiconductor, comprising:
a probe substrate; and
at least one contact element coupled to the probe substrate and extending therefrom, the at least one contact element comprising:
a tip having a first side configured to contact a terminal of a semiconductor device to be tested and an opposing second side; and
a plurality of deformed members lithographically formed in an initial shape upon and extending from the second side of the tip, the deformed members being permanently deformed into a deformed shape different than the initial shape, the deformed members being arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
10. The assembly of claim 9 , further comprising a base coupled to respective ends of the plurality of deformed members opposite the tip.
11. The assembly of claim 9 , wherein the tip further comprises one or more contacts extending from the first side thereof.
12. The assembly of claim 9 , wherein the tip and the plurality of deformed members are unitary.
13. The assembly of claim 9 , wherein the tip and deformed members comprise at least one of nickel, cobalt, copper, or beryllium.
14. The assembly of claim 9 , further comprising a plurality of contact elements.
15. The assembly of claim 14 , wherein the plurality of contact elements are arranged to correspond with a plurality of terminals disposed on a device to be tested.
16. The assembly of claim 9 , wherein the probe card assembly is configured to pass electrical signals to and from respective tips of the contact elements to a plurality of electrical connectors disposed on the probe card assembly.
17. A method of testing a semiconductor device, comprising:
providing a probe card assembly having at least one contact element comprising a tip having a first side configured to contact a terminal of a semiconductor device to be tested and an opposing second side, and a plurality of deformed members lithographically formed in an initial shape upon and extending from the second side of the tip, the deformed members being permanently deformed into a deformed shape different than the initial shape, the deformed members being arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members;
contacting at least one terminal of the device with respective tips of the at least one contact element; and
providing one or more electrical signals to the at least one terminal through the probe card assembly.
18. The method of claim 17 , wherein step of contacting further comprises:
moving at least one of the probe card assembly or the device to establish an initial contact between the plurality of terminals of the device and the tips of the contact elements; and
further moving at least one of the probe card assembly or the device to establish a desired contact pressure between the plurality of terminals of the device and the tips of the contact elements.
19. The method of claim 17 , wherein the resilient contact elements have a lower scrub distance when contacting the device as compared to cantilevered contact elements.
20. The method of claim 17 , wherein the contact elements produce a rotational scrub when contacting the device.
21. A semiconductor device tested by the method of claim 17 .
22. The element of claim 1 , wherein a largest cross-sectional dimension of the rotating contact element perpendicular to the axis of rotation is less than 1 mm.
23. The assembly of claim 9 , wherein a largest cross-sectional dimension of the contact element perpendicular to the axis of rotation is less than 1 mm.
24. The element of claim 1 , wherein a material composition of the deformed members comprises recrystallized material from heat treating the members.
25. The element of claim 2 , wherein the tip and the base are farther apart while the deformed members are in the deformed shape than while the deformed members are in the initial shape.
26. The assembly of claim 9 , wherein a material composition of the deformed members comprises recrystallized material from heat treating the members.
27. The assembly of claim 10 , wherein the tip and the base are farther apart while the deformed members are in the deformed shape than while the deformed members are in the initial shape.
28. The method of claim 17 , wherein a material composition of the deformed members comprises recrystallized material from heat treating the members.
29. The method of claim 17 further comprising a base, wherein the deformed members connect the tip and the base.
30. The method of claim 29 , wherein the tip and the base are farther apart while the deformed members are in the deformed shape than while the deformed members are in the initial shape.