IP Library Granted Patent US 7,750,652
Granted Patent B2
US 7,750,652 · App. 12/157,658 · Granted Jul 6, 2010

Test structure and probe for differential signals

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Quick Facts
Patent No.
US 7,750,652
App. No.
12/157,658
Granted
Jul 6, 2010
Kind
B2
Abstract

A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure.

Claims (27)

1. A test structure comprising a cell including a first in put signal probe pad capacitively interconnected to a first output signal probe pad and a second input signal probe pad capacitively interconnected to a second output signal probe pad, said test structure comprising:

(a) a first capacitor interconnecting said first input signal probe pad and said second output signal probe pad; and

(b) a second capacitor interconnecting said second input signal probe pad and said first output signal probe pad; wherein

said first capacitor has a capacitance substantially equal to a capacitance of said interconnection of said first input signal probe pad and said first output signal probe pad and said second capacitor has a capacitance substantially equal to a capacitance of said interconnection of said second input signal probe pad and said second output signal probe pad.

2. A probe for probing a cell comprising a first input signal probe pad capacitively interconnected to a first output signal probe pad and a second input signal probe pad capacitively interconnect to a second output signal probe pad, said probe comprising:

(a) a first probe tip connectible to a source of a first input signal and arranged for contact with said first input signal probe pad of said cell;

(b) a second probe tip connectible to a source of a second input signal and arranged for contact with said second input signal probe pad;

(c) a third probe tip connectible to a sink of a first output signal and arranged for contact with said first output signal probe pad;

(d) a fourth probe tip connectible to a sink of a second output signal and arranged to contact said second output signal probe pad;

(e) a first capacitor interconnecting said first probe tip and said fourth probe tip; and

(f) a second capacitor interconnecting said second probe tip and said third probe tip.

3. The probe of claim 2 wherein said first, said second, said third and said fourth probe tips are arranged in a linear array.

4. The probe of claim 2 wherein said capacitor interconnecting said first probe tip and said fourth probe tip has a capacitance substantially equal to a capacitance of said interconnection of said first input signal probe pad and said first output signal probe pad and said capacitor interconnecting said second probe tip and said third probe tip has a capacitance substantially equal to a capacitance of said interconnection of said second input signal probe pad and said second output signal probe pad.

5. The probe of claim 4 wherein said first, said second, said third and said fourth probe tips are arranged in a linear array.

6. A test structure for testing a functionality of a transistor, said test structure comprising:

(a) a first transistor including:

(i) a first terminal connectible through a first resistance to a source of a first component of a signal;

(ii) a second terminal connectible through a second resistance to a sink for a first component of an output signal and interconnected to said first terminal by a parasitic capacitance; and

(iii) a third terminal;

(b) a second transistor including:

(i) a first terminal connectible through a third resistance to a source of a second component of a signal;

(ii) a second terminal connectible through a fourth resistance to a sink for a second component of an output signal and interconnected to said first terminal by a parasitic capacitance; and

(iii) a third terminal interconnected with said third terminal of said first transistor and a source of a bias voltage;

(c) a first compensating capacitor connecting said first terminal of said first transistor to said second terminal of said second transistor; and

(d) a second compensating capacitor connecting said first terminal of said second transistor to said second terminal of said first transistor.

7. The test structure of claim 6 wherein said first compensating capacitor has a capacitance substantially equal to said parasitic capacitance interconnecting said first terminal of said first transistor and said second terminal of said first transistor and said second compensating capacitor has a capacitance substantially equal to said parasitic capacitance interconnecting said first terminal of said second transistor to said second terminal of said second transistor.

8. The test structure of claim 6 wherein said first, said second, said third and said fourth resistances have values selected to cause said test structure to have a gain approximating unity.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2008
From: CAMPBELL, RICHARD
To: CASCADE MICROTECH, INC.
Reel/Frame 021154/0001 →