Probe head arrays
View Patent ↗A probe head for testing devices formed on a semiconductor wafer includes a plurality of probe DUT (device under test) arrays. Each device under test includes pads that are urged into pressure contact with probes in a corresponding probe DUT array. The probe arrays patterns have discontinuities such as indentations, protuberances, islands and openings that are opposite at least one device when the probes contact the pads.
1. A contactor for testing devices formed on a semiconductor wafer, the contactor comprising a probe array for making contact with pads formed on the devices, said probe array including contiguous DUT arrays disposed around an opening in the probe array, the opening being over at least one device when the probe array contacts the pads,
wherein the contiguous DUT arrays are disposed to contact pads of a closed loop of adjacent ones of the devices,
the opening corresponds to at least one of the devices disposed within the closed loop of adjacent ones of the devices, and
the contiguous DUT arrays are configured to contact the devices of the closed loop of contiguous devices without contacting the at least one of the devices disposed within the closed loop of adjacent devices.
2. The contactor of claim 1 wherein said contiguous DUT arrays form a generally annular pattern.
3. The contactor of claim 1 wherein said opening in the DUT arrays is bounded by 4 DUT arrays.
4. The contactor of claim 1 , wherein said probe array includes no more than 161 probe DUT arrays.
5. The contactor of claim 4 , wherein said wafer includes at least 161 devices.
6. The contactor of claim 5 , wherein said probe DUT arrays are configured to permit testing of all the devices on the wafer by placing the probe DUT array in contact with a first set of the pads of the devices, and then placing the probe DUT array in contact with a second set of the pads of the devices, no more than 28 of the devices containing pads in both the first and the second sets of pads.
7. The contactor of claim 1 , wherein the probe array further includes additional DUT arrays disposed within the opening.
8. The contactor of claim 7 , wherein the additional DUT arrays include a pattern of contiguous ones of the additional DUT arrays disposed across the opening.
9. The contactor of claim 1 , wherein the opening corresponds to a plurality of the devices disposed within the contiguous closed loop of adjacent ones of the devices.
10. The contactor of claim 1 , wherein the devices are integrated circuit dies.
11. The contactor of claim 10 , wherein each DUT array has sufficient probes to contact one of the devices.
12. An apparatus for testing devices formed on a semiconductor wafer, the apparatus comprising probe DUT arrays arranged in a closed loop pattern that includes at least one opening contained within a perimeter of the pattern in which there is no probe DUT array, wherein:
the pattern of the probe DUT arrays corresponds to a pattern of a plurality of the devices,
the closed loop corresponds to a closed loop of contiguous ones of the plurality of the devices,
the opening corresponds to at least one of the devices located within the closed loop of contiguous devices, and
the probe DUT arrays are configured to contact the devices of the closed loop of contiguous devices without contacting the at least one of the devices located within the closed loop of contiguous devices.
13. The apparatus of claim 12 wherein said pattern includes at least one additional opening contained within the perimeter of the pattern in which there is no probe DUT array.
14. The apparatus of claim 12 wherein said pattern is generally annular.
15. The apparatus of claim 12 wherein said opening is bounded by 4 DUT arrays.
16. The apparatus of claim 12 , wherein said probe DUT array includes no more than 161 probe DUT arrays.
17. The apparatus of claim 16 , wherein said wafer includes at least 161 devices.
18. The apparatus of claim 17 , wherein said probe DUT arrays are configured to permit testing of all the devices on the wafer by placing the probe DUT array in contact with a first set of pads of the devices, and then placing the probe DUT array in contact with a second set of pads of the devices, no more than 28 of the devices containing pads in both the first and the second sets of pads.
19. The apparatus of claim 12 , wherein the devices are integrated circuit dies.
20. The apparatus of claim 12 , wherein each probe DUT array has sufficient probes to contact one of the devices.