Probe for semiconductor devices
View Patent ↗An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
1. A method of forming a resilient contact structure for an electronic component, comprising the steps of:
forming a recess having at least one negative projection in a sacrificial substrate;
forming a contact structure by filling at least a portion of the recess with a conducting material;
forming a resilient elongate element joining the contact structure and a contact pad on an electronic component; and
removing the sacrificial substrate.
2. The method of claim 1 , wherein forming the contact structure further comprises filling a least a portion of the recess with rhodium.
3. The method of claim 1 , wherein forming the contact structure further comprises filling at least a portion of the negative projection with rhodium.
4. The method of claim 1 , further comprising plating at least a portion of the contact structure with rhodium.
5. The method of claim 1 , wherein forming the resilient elongate element comprises:
bonding a wire to the contact structure and to the contact pad; and
overcoating the wire with a resilient material.
6. The method of claim 5 , wherein overcoating the wire further comprises overcoating at least a portion of the contact pad and at least one surface of the contact structure.
7. The method of claim 1 , wherein forming the contact structure further comprises filling a portion of the recess with an isolation layer followed by a conductive layer.
8. The method of claim 1 , wherein forming the resilient elongate element further comprises positioning the electronic component in vertical proximity to the sacrificial substrate.