INTERCONNECT ASSEMBLIES AND METHODS
Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
1 . An interconnect assembly comprising:
a substrate;
a contact element disposed on said substrate, a first portion of said contact element adapted to be free-standing and further adapted to be capable of moving from a first position to a second position when a force is applied to said first portion of said contact element; and
a stop structure disposed on a second portion of said contact element, said stop structure defining said second position.
2 - 42 . (canceled)