Methods for planarizing a semiconductor contactor
View Patent ↗A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
1. A method of changing shapes of surfaces of a plurality of substrates of a probe card assembly, wherein an array of contact elements is disposed on each of the surfaces, the method comprising:
activating a first deforming mechanism coupled to a first of the substrates and thereby deforming the surface of the first substrate and planarizing tips of the array of contact elements disposed on the surface of the first substrate; and
activating a second deforming mechanism coupled to a second of the substrates and thereby deforming the surface of the second substrate and planarizing tips of the array of contact elements disposed on the surface of the second substrate with the tips of the array of contact elements disposed on the surface of the first substrate,
wherein the surface of the first substrate remains deformed until the first deforming mechanism is again activated and the surface of the second substrate remains deformed until the second deforming mechanism is again activated.
2. The method of claim 1 , wherein:
the first deforming mechanism maintains the surface of the first substrate deformed except while the first deforming mechanism is being activated; and
the second deforming mechanism maintains the surface of the second substrate deformed except while the second deforming mechanism is being activated.
3. The method of claim 1 , wherein:
the first substrate comprises a ceramic wiring substrate; and
the second substrate comprises a ceramic wiring substrate.
4. The method of claim 1 , wherein the probe card assembly comprises:
a wiring substrate comprising an interface connectable to a tester for controlling testing of semiconductor dies in a test system;
the tips of the contact elements are configured to contact the semiconductor dies; and
the first substrate and the second substrate are coupled to the wiring substrate such that the probe card assembly can be attached to and removed from the test system as a single unit.
5. The method of claim 1 , wherein the activating the first deforming mechanism is performed without contacting the tips of the array of contact elements disposed on the surface of the first substrate, and the activating the second deforming mechanism is performed without contacting the tips of the away of contact elements disposed on the surface of the second substrate.
6. The method of claim 1 , wherein:
the first deforming mechanism comprises a plurality of first actuators, and
the second deforming mechanism comprises a plurality of second actuators.
7. The method of claim 1 , wherein the activating the first deforming mechanism comprises deflecting at least one of a first area of the surface of the first substrate, a second area of the surface of the first substrate, a third area of the surface of the first substrate, and a fourth area of the surface of the first substrate by applying a pulling force to the at least one of the first, second, third, and fourth areas of the surface of the first substrate.
8. The method of claim 7 , wherein the activating the second deforming mechanism comprises deflecting at least one of a first area of the surface of the second substrate, a second area of the surface of the second substrate, a third area of the surface of the second substrate, and a fourth area of the surface of the second substrate by applying a pulling force to the at least one of the first, second, third, and fourth areas of the surface of the second substrate.
9. The method of claim 1 , wherein the activating the first deforming mechanism comprises:
applying with the first deforming mechanism a pulling force to a first area of the surface of the first substrate; and
applying with the first deforming mechanism a pushing force to at least one other area of the surface of the first substrate different than the first area of the surface of the first substrate.
10. The method of claim 9 , wherein the activating the second deforming mechanism comprises:
applying with the second deforming mechanism a pulling force to a first area of the surface of the second substrate; and
applying with the second deforming mechanism a pushing force to at least one other of the surface of the second substrate different than the first area of the surface of the second substrate.
11. The method of claim 10 , wherein:
the first deforming mechanism maintains relative positions of the first area and the at least one other area of the surface of the first substrate with respect to each other except while the first deforming mechanism is being activated; and
the second deforming mechanism maintains relative positions of the first area and the at least one other area of the surface of the second substrate with respect to each other except while the second deforming mechanism is being activated.
12. The method of claim 11 , wherein:
the first actuator comprises a first screw assembly, and
the activating the first actuator comprises turning a screw of the first screw assembly.
13. The method of claim 12 , wherein the first screw assembly maintains the pulling force on the first area of the first substrate.
14. The method of claim 12 , wherein the applying with the first deforming mechanism the pushing force comprises activating at least one second of the plurality of actuators each of which is in contact with one of the at least one other areas of the surface of the first substrate.
15. The method of claim 14 , wherein:
each of the at least one second actuators comprises a second screw assembly, and
the activating the at least one second actuator comprises turning a screw of the second screw assembly.
16. The method of claim 15 , wherein the second screw assembly maintains the pulling force on the at least one other area of the second substrate.
17. The method of claim 15 , wherein:
the first substrate comprises a ceramic wiring substrate; and
the second substrate comprises a ceramic wiring substrate.
18. The method of claim 15 , wherein the probe card assembly comprises:
a wiring substrate comprising an interface connectable to a tester for controlling testing of semiconductor dies in a test system;
the tips of the contact elements are configured to contact the semiconductor dies; and
the first substrate and the second substrate are coupled to the wiring substrate such that the probe card assembly can be attached to and removed from the test system as a single unit.
19. The method of claim 15 , wherein the activating the first deforming mechanism is performed without contacting the tips of the array of contact elements disposed on the surface of the first substrate, and the activating the second deforming mechanism is performed without contacting the tips of the away of contact elements disposed on the surface of the second substrate.
20. The method of claim 9 , wherein:
the first deforming mechanism comprises a plurality of actuators, and
the applying with the first deforming mechanism the pulling force comprises activating a first of the plurality of actuators, which is attached to the first area of the surface of the first substrate.