Pre-aligner search

1. A method comprising:

receiving a wafer to be transferred between a first mechanism and a second mechanism;

sensing a first vacuum suction between the wafer and the first mechanism;

positioning the wafer in a position defining a gap between the wafer and the second mechanism;

closing the gap over a set of two or more increments

between the wafer and the second mechanism, wherein each of the increments is less than the gap;

detecting, at each increment in the set of increments, whether a second vacuum suction is created between the wafer and the second mechanism; and

releasing the first vacuum suction between the wafer and the first mechanism when a second vacuum suction is detected between the wafer and the second mechanism.

2. The method of claim 1 , wherein the compliance of the wafer during transfer from the first mechanism to the second mechanism allows for at least 1 mm of flexing to occur with the wafer without causing damage to the wafer.

3. The method of claim 1 , wherein the wafer has 1 to 12 mm of warping.

4. The method of claim 1 , wherein the first mechanism is a pre-aligning chuck and the second mechanism is a transfer arm, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

5. The method of claim 4 , further comprising transferring the wafer from the transfer arm to a storage position.

6. The method of claim 1 , wherein closing the gap includes incrementally moving the first mechanism, the second mechanism, or both.

7. The method of claim 6 , wherein the moving includes incremental movements of about 5 mils.

8. The method of claim 1 , wherein the first mechanism is a transfer arm and the second mechanism is a pre-aligning chuck, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

9. The method of claim 8 , further comprising flattening the wafer on a surface of the pre-aligning chuck that is configured to rotate the wafer to a pre-aligned position.

10. The method of claim 9 , further comprising transferring the pre-aligned wafer from the pre-aligning chuck to a test position to allow probing of the wafer.

11. A machine readable medium having stored thereon data representing sequences of instructions, which when executed by a computer system cause the computer system to perform a method comprising:

receiving a wafer to be transferred between a first mechanism and a second mechanism;

sensing a first vacuum suction between the wafer and the first mechanism;

positioning the wafer in a position defining a gap between the wafer and the second mechanism;

closing the gap over a set of two or more increments

between the wafer and the second mechanism,

wherein each of the increments is less than the gap;

detecting, at each increment in the set of increments, whether a second vacuum suction is created between the wafer and the second mechanism; and

releasing the first vacuum suction between the wafer and the first mechanism when a second vacuum suction is detected between the wafer and the second mechanism.

12. The machine readable medium of claim 11 , wherein the first mechanism is a transfer arm and the second mechanism is a pre-aligning chuck, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

13. The machine readable medium of claim 11 , wherein the first mechanism is a pre-aligning chuck and the second mechanism is a transfer arm, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

14. The machine readable medium of claim 11 , wherein the compliance of the wafer during transfer from the first mechanism to the second mechanism allows for at least 1 mm of flexing to occur with the wafer without causing damage to the wafer.

15. The machine readable medium of claim 11 , wherein closing the gap includes incrementally moving the first mechanism, the second mechanism, or both.

16. The machine readable medium of claim 15 , wherein the moving includes incremental movements of about 5 mils.

17. A system comprising:

a base;

a first mechanism supported by the base and configured to engage a wafer with a first vacuum suction;

a second mechanism supported by the base and configured to engage the wafer with a second vacuum suction and to receive the wafer from the first mechanism;

at least one sensor coupled with the first and second mechanism, the at least one sensor being configured to determine whether the wafer is engaged with a respective mechanism after a gap is closed over a set of two or more increments between the first and second mechanism, wherein each of the increments is less than the gap; and

a control system coupled with the at least one sensor, the control system being configured to receive information at each increment in the set of increments, from the at least one sensor and to determine whether to release the first vacuum suction between the wafer and the first mechanism when a second vacuum suction is detected between the wafer and the second mechanism.

18. The system of claim 17 , wherein the first mechanism is a transfer arm and the second mechanism is a pre-aligning chuck, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

19. The system of claim 17 , wherein the first mechanism is a pre-aligning chuck and the second mechanism is a transfer arm, and wherein a compliance in the wafer allows a transfer between the transfer arm and the pre-aligning chuck mechanism to occur without damaging the wafer.

20. The system of claim 17 , wherein closing the gap includes incrementally moving the first mechanism, the second mechanism, or both.