Method of forming an interconnection element
View Patent ↗A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
1. A method of forming an interconnection element comprising: forming a free-standing first structure coupled at a first end to a first substrate, a second end of the free-standing first structure spaced away from the substrate and being free to flex toward the substrate, the first structure comprising a first material and having a first spring constant;
applying a masking material to the free-standing first structure while the first structure is free standing with the second end spaced away from the substrate and free to flex toward the substrate; and
coating on the free-standing first structure a second structure of a second material through an opening in the masking material on the first structure, the first structure and the second structure comprising the interconnection element and the interconnection element having a spring constant greater than the spring constant of the first structure.
2. The method of claim 1 , wherein coating the second structure comprises overlying a portion of the first structure.
3. The method of claim 1 , wherein the substrate is a first substrate, the method further comprising transferring the interconnection element from the first substrate to a second substrate.
4. The method of claim 1 , wherein creating the free-standing first structure further comprises forming a pre-release structure having a base coupled to the structure and a free end extending over a portion of the substrate; and releasing the free end from the first substrate to form a cantilever.
5. The method of claim 1 , further comprising transferring the interconnection element to a second substrate.
6. The method of claim 1 , wherein the masking material is an electrophoretic resist.
7. The method of claim 1 , wherein the first spring constant is sufficient for repeated elastic displacement of the first structure without substantial plastic deformation of the first structure.
8. The method of claim 1 , further comprising using the interconnection element to test an electronic component.
9. The method of claim 1 , further comprising removing the masking material.
10. The method of claim 1 , further comprising coupling a probe material to the second material through the opening of the masking material.
11. The method of claim 10 , further comprising removing the masking material.
12. The method of claim 1 , further comprising fabricating a travel stop for the interconnection element.
13. The method of claim 1 , further comprising depositing an overcoating of contact material over the interconnection element.