IP Library Granted Patent US 7,731,546
Granted Patent B2
US 7,731,546 · App. 11/228,966 · Granted Jun 8, 2010

Microelectronic contact structure

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Quick Facts
Patent No.
US 7,731,546
App. No.
11/228,966
Granted
Jun 8, 2010
Kind
B2
Abstract

A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.

Claims (32)

1. A probing apparatus comprising:

a plurality of contact probes of a type disposed along an axis, each of the contact probes comprising:

a contact portion;

a base portion; and

a resilient portion disposed between the contact portion and the base portion, the resilient portion comprising a plurality of arms; and

a substrate having through holes into which the plurality of contact probes are inserted, the resilient portion of each of the contact probes biasing the contact portion such that at least a portion of the contact portion extends out of a through hole,

wherein the through holes are threaded, and the contact portion of each of the contact probes further comprises a thread engaging structure that engages the threading of the through holes in a manner that causes the contact portion to rotate with respect to the base portion when the contact probe is compressed.

2. The probing apparatus of claim 1 , wherein each of the contact probes further comprises an anchor portion disposed against a surface of the substrate.

3. The contact probe of claim 1 , wherein each of the through holes comprises a helically-threaded tube.

4. The probing apparatus of claim 3 , wherein each of the threaded tubes comprises rhodium.

5. The probing apparatus of claim 1 , wherein the axis of each contact structure passes through the contact portion, the base portion, and the resilient portion of the contact structure, and each contact probe is configured to twist about the axis of the contact structure.

6. The probing apparatus of claim 1 , wherein each of the plurality of arms comprises a first end attached to the base portion and a second end attached to the contact portion, wherein the second end of each of the plurality of arms is displaced around the axis with respect to its corresponding first end, whereby the contact portion rotates around the axis with respect to the base portion, when the contact probe is compressed.

7. The apparatus of claim 1 , wherein:

the contact probes each comprise a plurality of laminated structural layers;

the contact portion is defined in the laminated structural layers;

the base portion is defined in the laminated structural layers; and

the plurality of arms is defined in at least two of the plurality of layers.

8. The apparatus of claim 7 , wherein:

the contact portion is defined in all of the structural layers;

the base portion is defined in all of the structural layers; and

each of the arms of the resilient portion is defined in fewer than all of the structural layers.

9. The probing apparatus of claim 1 , wherein each of the contact probes buckles towards a side of one of the through holes when the contact probe is compressed.

10. A probing apparatus comprising:

a plurality of contact probes of a type disposed along an axis, each of the contact probes comprising:

a plurality of laminated structural layers;

a contact portion defined in all the structural layers;

a base portion defined in all the structural layers; and

a resilient portion disposed between the contact portion and the base portion, the resilient portion comprising a plurality of arms defined in fewer than all the plurality of layers; and

a substrate having through holes into which the plurality of contact probes are inserted, the resilient portion of each of the contact probes biasing the contact portion such that at least a portion of the contact portion extends out of a through hole, wherein each of the through holes has a uniform diameter.

11. The apparatus of claim 10 , wherein the contact probes are configured to twist the contact portion when compressed.

12. The probing apparatus of claim 10 , wherein each of the contact probes buckles towards a side of one of the through holes when the contact probe is compressed.

13. The probing apparatus of claim 10 , wherein the plurality of layers are substantially parallel and disposed in a stack.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2025
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: FORMFACTOR, INC.
Reel/Frame 072853/0001 →
SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS Recorded Jul 12, 2016
From: FORMFACTOR, INC.; ASTRIA SEMICONDUCTOR HOLDINGS, INC.; CASCADE MICROTECH, INC.; MICRO-PROBE INCORPORATED
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 039184/0280 →